ESQT-108-02-F-D-309 Samtec
auf Bestellung 68 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 6.81 EUR |
| 50+ | 5.54 EUR |
| 100+ | 4.72 EUR |
| 500+ | 4.19 EUR |
| 1000+ | 4.07 EUR |
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Technische Details ESQT-108-02-F-D-309 Samtec
Description: CONN SOCKET 16POS 0.079 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Current Rating (Amps): 4.5A per Contact, Mounting Type: Through Hole, Number of Positions: 16, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Contact Length - Post: 0.541" (13.74mm), Insulation Height: 0.309" (7.85mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 2.
Weitere Produktangebote ESQT-108-02-F-D-309 nach Preis ab 4.45 EUR bis 8.87 EUR
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ESQT-108-02-F-D-309 | Hersteller : Samtec Inc. |
 Description: CONN SOCKET 16POS 0.079 GOLD PCBPackaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 4.5A per Contact Mounting Type: Through Hole Number of Positions: 16 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Contact Length - Post: 0.541" (13.74mm) Insulation Height: 0.309" (7.85mm) Row Spacing - Mating: 0.079" (2.00mm) Number of Rows: 2 |
auf Bestellung 864 Stücke: Lieferzeit 10-14 Tag (e) |
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