ESQT-109-03-F-D-310 SAMTEC
Hersteller: SAMTEC
Description: SAMTEC - ESQT-109-03-F-D-310 - Stapelbare Leiterplattensteckverbinder, erhöht, ESQT, 18 Kontakt(e), Buchse, 2 mm
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
Kontaktanschluss: Durchsteckmontage
rohsCompliant: YES
Rastermaß: 2mm
Ausführung: Buchse
Anzahl der Kontakte: 18Kontakt(e)
euEccn: NLR
Anzahl der Reihen: 2Reihe(n)
Kontaktmaterial: Phosphorbronze
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: ESQT
SVHC: No SVHC (15-Jan-2018)
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Technische Details ESQT-109-03-F-D-310 SAMTEC
Description: CONN SOCKET 18POS 0.079 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Current Rating (Amps): 4.5A per Contact, Mounting Type: Through Hole, Number of Positions: 18, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Contact Length - Post: 0.148" (3.76mm), Insulation Height: 0.310" (7.87mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 2.
Weitere Produktangebote ESQT-109-03-F-D-310 nach Preis ab 5.85 EUR bis 10.12 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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ESQT-109-03-F-D-310 | Samtec Inc. |
Description: CONN SOCKET 18POS 0.079 GOLD PCB Packaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 4.5A per Contact Mounting Type: Through Hole Number of Positions: 18 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Contact Length - Post: 0.148" (3.76mm) Insulation Height: 0.310" (7.87mm) Row Spacing - Mating: 0.079" (2.00mm) Number of Rows: 2 |
auf Bestellung 1974 Stücke: Lieferzeit 10-14 Tag (e) |
|
| ESQT-109-03-F-D-310 |
Hersteller: Samtec Inc.
Description: CONN SOCKET 18POS 0.079 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 4.5A per Contact
Mounting Type: Through Hole
Number of Positions: 18
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.148" (3.76mm)
Insulation Height: 0.310" (7.87mm)
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 2
Description: CONN SOCKET 18POS 0.079 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 4.5A per Contact
Mounting Type: Through Hole
Number of Positions: 18
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.148" (3.76mm)
Insulation Height: 0.310" (7.87mm)
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 2
auf Bestellung 1974 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 10.12 EUR |
| 10+ | 9.17 EUR |
| 100+ | 8.08 EUR |
| 1000+ | 5.85 EUR |