ESQT-109-03-F-D-310 Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN SOCKET 18POS 0.079 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 4.5A per Contact
Mounting Type: Through Hole
Number of Positions: 18
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.148" (3.76mm)
Insulation Height: 0.310" (7.87mm)
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 2
Description: CONN SOCKET 18POS 0.079 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 4.5A per Contact
Mounting Type: Through Hole
Number of Positions: 18
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.148" (3.76mm)
Insulation Height: 0.310" (7.87mm)
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 2
auf Bestellung 1974 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 8.50 EUR |
| 10+ | 7.71 EUR |
| 100+ | 6.79 EUR |
| 1000+ | 4.92 EUR |
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Technische Details ESQT-109-03-F-D-310 Samtec Inc.
Description: CONN SOCKET 18POS 0.079 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Current Rating (Amps): 4.5A per Contact, Mounting Type: Through Hole, Number of Positions: 18, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Contact Length - Post: 0.148" (3.76mm), Insulation Height: 0.310" (7.87mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 2.
Weitere Produktangebote ESQT-109-03-F-D-310
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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ESQT-109-03-F-D-310 | Hersteller : SAMTEC |
 Description: SAMTEC - ESQT-109-03-F-D-310 - Stapelbare Leiterplattensteckverbinder, erhöht, ESQT, 18 Kontakt(e), Buchse, 2 mmtariffCode: 85366930 productTraceability: No Kontaktüberzug: Vergoldete Kontakte Kontaktanschluss: Durchsteckmontage rohsCompliant: YES Rastermaß: 2mm Ausführung: Buchse Anzahl der Kontakte: 18Kontakt(e) euEccn: NLR Anzahl der Reihen: 2Reihe(n) Kontaktmaterial: Phosphorbronze hazardous: false rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: ESQT SVHC: No SVHC (15-Jan-2018) |
auf Bestellung 100 Stücke: Lieferzeit 14-21 Tag (e) |
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ESQT-109-03-F-D-310 | Hersteller : Samtec |
Headers & Wire Housings 2.00 mm FleXYZ Flexible Elevated Socket Strip |
Produkt ist nicht verfügbar |