
ESQT-110-02-H-D-408 Samtec
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 13.08 EUR |
10+ | 12.07 EUR |
25+ | 11.42 EUR |
50+ | 11.02 EUR |
100+ | 10.68 EUR |
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Technische Details ESQT-110-02-H-D-408 Samtec
Description: CONN SOCKET 20POS 0.079 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Current Rating (Amps): 4.5A per Contact, Mounting Type: Through Hole, Number of Positions: 20, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Gold, Part Status: Active, Contact Length - Post: 0.442" (11.23mm), Insulation Height: 0.408" (10.36mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 2.
Weitere Produktangebote ESQT-110-02-H-D-408 nach Preis ab 16.46 EUR bis 21.42 EUR
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ESQT-110-02-H-D-408 | Hersteller : Samtec Inc. |
![]() Packaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 4.5A per Contact Mounting Type: Through Hole Number of Positions: 20 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Gold Part Status: Active Contact Length - Post: 0.442" (11.23mm) Insulation Height: 0.408" (10.36mm) Row Spacing - Mating: 0.079" (2.00mm) Number of Rows: 2 |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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