ESQT-110-02-M-Q-740 Samtec
auf Bestellung 12 Stücke:
Lieferzeit 14-28 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
2+ | 27.64 EUR |
10+ | 25.53 EUR |
25+ | 24.15 EUR |
50+ | 23.3 EUR |
100+ | 22.57 EUR |
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Technische Details ESQT-110-02-M-Q-740 Samtec
Description: CONN SOCKET 40POS 0.079 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Current Rating (Amps): 4.5A per Contact, Mounting Type: Through Hole, Number of Positions: 40, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Finish - Post: Tin, Contact Length - Post: 0.110" (2.79mm), Insulation Height: 0.740" (18.80mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 4.
Weitere Produktangebote ESQT-110-02-M-Q-740
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
ESQT-110-02-M-Q-740 | Hersteller : Samtec Inc. |
Description: CONN SOCKET 40POS 0.079 GOLD PCB Packaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 4.5A per Contact Mounting Type: Through Hole Number of Positions: 40 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Finish - Post: Tin Contact Length - Post: 0.110" (2.79mm) Insulation Height: 0.740" (18.80mm) Row Spacing - Mating: 0.079" (2.00mm) Number of Rows: 4 |
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