ESQT-110-03-F-D-334 Samtec
| Anzahl | Privatkunde |
|---|---|
| 1+ | 7.2 EUR |
| 25+ | 6.51 EUR |
| 50+ | 6.06 EUR |
| 100+ | 5.76 EUR |
| 500+ | 5.62 EUR |
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Technische Details ESQT-110-03-F-D-334 Samtec
Description: CONN SOCKET 20POS 0.079 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Current Rating (Amps): 4.5A per Contact, Mounting Type: Through Hole, Number of Positions: 20, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Part Status: Active, Contact Length - Post: 0.124" (3.15mm), Insulation Height: 0.334" (8.48mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 2.
Weitere Produktangebote ESQT-110-03-F-D-334 nach Preis ab 7.32 EUR bis 12.34 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
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ESQT-110-03-F-D-334 | Samtec Inc. |
 Description: CONN SOCKET 20POS 0.079 GOLD PCBPackaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 4.5A per Contact Mounting Type: Through Hole Number of Positions: 20 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.124" (3.15mm) Insulation Height: 0.334" (8.48mm) Row Spacing - Mating: 0.079" (2.00mm) Number of Rows: 2 |
auf Bestellung 127 Stücke: Lieferzeit 10-14 Tag (e) |
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ESQT-110-03-F-D-334 | SAMTEC |
Description: SAMTEC - ESQT-110-03-F-D-334 - Stapelbare Leiterplattensteckverbinder, erhöht, ESQT, 20 Kontakt(e), Buchse, 2 mm tariffCode: 85366930 productTraceability: No Kontaktüberzug: Vergoldete Kontakte Kontaktanschluss: Durchsteckmontage rohsCompliant: YES Rastermaß: 2mm Ausführung: Buchse Anzahl der Kontakte: 20Kontakt(e) euEccn: NLR isCanonical: Y Anzahl der Reihen: 2Reihe(n) Kontaktmaterial: Phosphorbronze hazardous: false rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: ESQT SVHC: No SVHC (25-Jun-2025) |
auf Bestellung 11 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| ESQT-110-03-F-D-334 |
|
Hersteller: Samtec Inc.
Description: CONN SOCKET 20POS 0.079 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 4.5A per Contact
Mounting Type: Through Hole
Number of Positions: 20
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.124" (3.15mm)
Insulation Height: 0.334" (8.48mm)
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 2
Description: CONN SOCKET 20POS 0.079 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 4.5A per Contact
Mounting Type: Through Hole
Number of Positions: 20
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.124" (3.15mm)
Insulation Height: 0.334" (8.48mm)
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 2
auf Bestellung 127 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.34 EUR |
| 10+ | 9.44 EUR |
| 100+ | 7.32 EUR |
| ESQT-110-03-F-D-334 |
|
Hersteller: SAMTEC
Description: SAMTEC - ESQT-110-03-F-D-334 - Stapelbare Leiterplattensteckverbinder, erhöht, ESQT, 20 Kontakt(e), Buchse, 2 mm
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
Kontaktanschluss: Durchsteckmontage
rohsCompliant: YES
Rastermaß: 2mm
Ausführung: Buchse
Anzahl der Kontakte: 20Kontakt(e)
euEccn: NLR
isCanonical: Y
Anzahl der Reihen: 2Reihe(n)
Kontaktmaterial: Phosphorbronze
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: ESQT
SVHC: No SVHC (25-Jun-2025)
Description: SAMTEC - ESQT-110-03-F-D-334 - Stapelbare Leiterplattensteckverbinder, erhöht, ESQT, 20 Kontakt(e), Buchse, 2 mm
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
Kontaktanschluss: Durchsteckmontage
rohsCompliant: YES
Rastermaß: 2mm
Ausführung: Buchse
Anzahl der Kontakte: 20Kontakt(e)
euEccn: NLR
isCanonical: Y
Anzahl der Reihen: 2Reihe(n)
Kontaktmaterial: Phosphorbronze
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: ESQT
SVHC: No SVHC (25-Jun-2025)
auf Bestellung 11 Stücke:
Lieferzeit 14-21 Tag (e)