ESQT-110-03-F-Q-309 Samtec Inc.
Hersteller: Samtec Inc.Description: CONN SOCKET 40POS 0.079 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 4.5A per Contact
Mounting Type: Through Hole
Number of Positions: 40
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.149" (3.78mm)
Insulation Height: 0.309" (7.85mm)
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 4
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 10.38 EUR |
| 10+ | 8.83 EUR |
| 100+ | 7.51 EUR |
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Technische Details ESQT-110-03-F-Q-309 Samtec Inc.
Description: CONN SOCKET 40POS 0.079 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Current Rating (Amps): 4.5A per Contact, Mounting Type: Through Hole, Number of Positions: 40, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Contact Length - Post: 0.149" (3.78mm), Insulation Height: 0.309" (7.85mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 4.
Weitere Produktangebote ESQT-110-03-F-Q-309
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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ESQT-110-03-F-Q-309 | Hersteller : Samtec |
Headers & Wire Housings FleXYZ Flexible-Height Socket Strip, 2.00mm Pitch |
Produkt ist nicht verfügbar |