ESQT-110-03-L-D-310 Samtec
| Anzahl | Preis |
|---|---|
| 1+ | 7.57 EUR |
| 25+ | 6.85 EUR |
| 50+ | 6.35 EUR |
| 100+ | 6.05 EUR |
| 500+ | 5.88 EUR |
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Technische Details ESQT-110-03-L-D-310 Samtec
Description: CONN SOCKET 20POS 0.079 GOLD PCB, Operating Temperature: -55°C ~ 125°C, Style: Board to Board or Cable, Number of Positions: 20, Mounting Type: Through Hole, Current Rating (Amps): 4.5A per Contact, Connector Type: Elevated Socket, Packaging: Bulk, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Number of Rows: 2, Row Spacing - Mating: 0.079" (2.00mm), Insulation Height: 0.310" (7.87mm), Contact Length - Post: 0.148" (3.76mm), Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.079" (2.00mm), Insulation Color: Black, Contact Type: Forked.
Weitere Produktangebote ESQT-110-03-L-D-310 nach Preis ab 12.64 EUR bis 12.64 EUR
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ESQT-110-03-L-D-310 | Hersteller : Samtec Inc. |
 Description: CONN SOCKET 20POS 0.079 GOLD PCBOperating Temperature: -55°C ~ 125°C Style: Board to Board or Cable Number of Positions: 20 Mounting Type: Through Hole Current Rating (Amps): 4.5A per Contact Connector Type: Elevated Socket Packaging: Bulk Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Number of Rows: 2 Row Spacing - Mating: 0.079" (2.00mm) Insulation Height: 0.310" (7.87mm) Contact Length - Post: 0.148" (3.76mm) Contact Finish - Post: Tin Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.079" (2.00mm) Insulation Color: Black Contact Type: Forked |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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