ESQT-110-03-M-D-388 Samtec
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 9.56 EUR |
| 25+ | 8.64 EUR |
| 50+ | 8.03 EUR |
| 100+ | 7.64 EUR |
| 500+ | 7.41 EUR |
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Technische Details ESQT-110-03-M-D-388 Samtec
Description: CONN SOCKET 20POS 0.079 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Current Rating (Amps): 4.5A per Contact, Mounting Type: Through Hole, Number of Positions: 20, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Finish - Post: Tin, Contact Length - Post: 0.070" (1.78mm), Insulation Height: 0.388" (9.86mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 2.
Weitere Produktangebote ESQT-110-03-M-D-388 nach Preis ab 7.10 EUR bis 11.93 EUR
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ESQT-110-03-M-D-388 | Hersteller : Samtec Inc. |
 Description: CONN SOCKET 20POS 0.079 GOLD PCBPackaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 4.5A per Contact Mounting Type: Through Hole Number of Positions: 20 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Finish - Post: Tin Contact Length - Post: 0.070" (1.78mm) Insulation Height: 0.388" (9.86mm) Row Spacing - Mating: 0.079" (2.00mm) Number of Rows: 2 |
auf Bestellung 468 Stücke: Lieferzeit 10-14 Tag (e) |
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