ESQT-111-03-LM-S-330 Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN SOCKET 11POS 0.079 GOLD PCB
Packaging: Bulk
Number of Rows: 1
Insulation Height: 0.330" (8.38mm)
Contact Length - Post: 0.128" (3.25mm)
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Forked
Operating Temperature: -55°C ~ 125°C
Style: Board to Board or Cable
Number of Positions: 11
Mounting Type: Through Hole
Current Rating (Amps): 4.5A per Contact
Connector Type: Elevated Socket
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Technische Details ESQT-111-03-LM-S-330 Samtec Inc.
Description: CONN SOCKET 11POS 0.079 GOLD PCB, Packaging: Bulk, Number of Rows: 1, Insulation Height: 0.330" (8.38mm), Contact Length - Post: 0.128" (3.25mm), Part Status: Active, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.079" (2.00mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Forked, Operating Temperature: -55°C ~ 125°C, Style: Board to Board or Cable, Number of Positions: 11, Mounting Type: Through Hole, Current Rating (Amps): 4.5A per Contact, Connector Type: Elevated Socket.
Weitere Produktangebote ESQT-111-03-LM-S-330
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Verfügbarkeit |
Preis |
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ESQT-111-03-LM-S-330 | Hersteller : Samtec |
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