Technische Details ESQT-112-02-S-D-638 Samtec
Description: CONN SOCKET 24POS 0.079 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Current Rating (Amps): 4.5A per Contact, Mounting Type: Through Hole, Number of Positions: 24, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Contact Length - Post: 0.212" (5.38mm), Insulation Height: 0.638" (16.20mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 2.
Weitere Produktangebote ESQT-112-02-S-D-638
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
ESQT-112-02-S-D-638 | Samtec |
 Conn Elevated Socket RCP 24 POS 2mm Solder ST Top Entry Thru-Hole Layer |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| ESQT-112-02-S-D-638 | Samtec Inc. |
Description: CONN SOCKET 24POS 0.079 GOLD PCB Packaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 4.5A per Contact Mounting Type: Through Hole Number of Positions: 24 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Contact Length - Post: 0.212" (5.38mm) Insulation Height: 0.638" (16.20mm) Row Spacing - Mating: 0.079" (2.00mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |
 |
ESQT-112-02-S-D-638 | Samtec |
Headers & Wire Housings FleXYZ Flexible-Height Socket Strip |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| ESQT-112-02-S-D-638 |
|
Hersteller: Samtec
Conn Elevated Socket RCP 24 POS 2mm Solder ST Top Entry Thru-Hole Layer
Conn Elevated Socket RCP 24 POS 2mm Solder ST Top Entry Thru-Hole Layer
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ESQT-112-02-S-D-638 |
Hersteller: Samtec Inc.
Description: CONN SOCKET 24POS 0.079 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 4.5A per Contact
Mounting Type: Through Hole
Number of Positions: 24
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.212" (5.38mm)
Insulation Height: 0.638" (16.20mm)
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 2
Description: CONN SOCKET 24POS 0.079 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 4.5A per Contact
Mounting Type: Through Hole
Number of Positions: 24
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.212" (5.38mm)
Insulation Height: 0.638" (16.20mm)
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 2
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ESQT-112-02-S-D-638 |
|
Hersteller: Samtec
Headers & Wire Housings FleXYZ Flexible-Height Socket Strip
Headers & Wire Housings FleXYZ Flexible-Height Socket Strip
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH