ESQT-130-02-G-T-665 Samtec
auf Bestellung 58 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 50.53 EUR |
27+ | 46.02 EUR |
54+ | 44.92 EUR |
108+ | 43.54 EUR |
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Technische Details ESQT-130-02-G-T-665 Samtec
Description: CONN SOCKET 90POS 0.079 GOLD PCB, Packaging: Tube, Connector Type: Elevated Socket, Current Rating (Amps): 4.5A per Contact, Mounting Type: Through Hole, Number of Positions: 90, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Finish - Post: Gold, Part Status: Active, Contact Length - Post: 0.185" (4.70mm), Insulation Height: 0.665" (16.90mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 3.
Weitere Produktangebote ESQT-130-02-G-T-665 nach Preis ab 48 EUR bis 54.82 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
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ESQT-130-02-G-T-665 | Hersteller : Samtec Inc. |
Description: CONN SOCKET 90POS 0.079 GOLD PCB Packaging: Tube Connector Type: Elevated Socket Current Rating (Amps): 4.5A per Contact Mounting Type: Through Hole Number of Positions: 90 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Finish - Post: Gold Part Status: Active Contact Length - Post: 0.185" (4.70mm) Insulation Height: 0.665" (16.90mm) Row Spacing - Mating: 0.079" (2.00mm) Number of Rows: 3 |
auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
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ESQT-130-02-G-T-665 | Hersteller : Samtec | Conn Elevated Socket SKT 90 POS 2mm Solder ST Top Entry Thru-Hole Tube |
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