Produkte > SAMTEC INC. > ESQT-130-02-H-T-665

ESQT-130-02-H-T-665 Samtec Inc.



Hersteller: Samtec Inc.
Description: CONN SOCKET 90POS 0.079 GOLD PCB
Number of Rows: 3
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.665" (16.90mm)
Contact Length - Post: 0.185" (4.70mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Forked
Operating Temperature: -55°C ~ 125°C
Style: Board to Board or Cable
Number of Positions: 90
Mounting Type: Through Hole
Current Rating (Amps): 4.5A per Contact
Connector Type: Elevated Socket
Packaging: Tube
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Technische Details ESQT-130-02-H-T-665 Samtec Inc.

Description: CONN SOCKET 90POS 0.079 GOLD PCB, Number of Rows: 3, Row Spacing - Mating: 0.079" (2.00mm), Insulation Height: 0.665" (16.90mm), Contact Length - Post: 0.185" (4.70mm), Contact Finish - Post: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.079" (2.00mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Forked, Operating Temperature: -55°C ~ 125°C, Style: Board to Board or Cable, Number of Positions: 90, Mounting Type: Through Hole, Current Rating (Amps): 4.5A per Contact, Connector Type: Elevated Socket, Packaging: Tube.

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ESQT-130-02-H-T-665 ESQT-130-02-H-T-665 Samtec esqt_th-2854210.pdf Headers & Wire Housings FleXYZ Flexible-Height Socket Strip, 2.00mm Pitch
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
ESQT-130-02-H-T-665 esqt_th-2854210.pdf
Hersteller: Samtec
Headers & Wire Housings FleXYZ Flexible-Height Socket Strip, 2.00mm Pitch
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH