Produkte > SAMTEC INC. > ESQT-140-03-M-Q-360

ESQT-140-03-M-Q-360 Samtec Inc.

esqt_th.pdf
Hersteller: Samtec Inc.
Description: CONN SOCKET 160P 0.079 GOLD PCB
Packaging: Tube
Connector Type: Elevated Socket
Current Rating (Amps): 4.5A per Contact
Mounting Type: Through Hole
Number of Positions: 160
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.098" (2.50mm)
Insulation Height: 0.360" (9.14mm)
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 4
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Technische Details ESQT-140-03-M-Q-360 Samtec Inc.

Description: CONN SOCKET 160P 0.079 GOLD PCB, Packaging: Tube, Connector Type: Elevated Socket, Current Rating (Amps): 4.5A per Contact, Mounting Type: Through Hole, Number of Positions: 160, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Finish - Post: Tin, Contact Length - Post: 0.098" (2.50mm), Insulation Height: 0.360" (9.14mm), Row Spacing - Mating: 0.079" (2.00mm), Number of Rows: 4.

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ESQT-140-03-M-Q-360 Samtec Inc. esqt_th.pdf Description: CONN SOCKET 160P 0.079 GOLD PCB
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Forked
Operating Temperature: -55°C ~ 125°C
Style: Board to Board or Cable
Number of Positions: 160
Mounting Type: Through Hole
Current Rating (Amps): 4.5A per Contact
Connector Type: Elevated Socket
Packaging: Tube
Number of Rows: 4
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.360" (9.14mm)
Contact Length - Post: 0.098" (2.50mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Produkt ist nicht verfügbar
 Mindestbestellmenge: 7 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
ESQT-140-03-M-Q-360 Samtec esqt_th-1369934.pdf Headers & Wire Housings 2.00 mm FleXYZ Flexible Elevated Socket Strip
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
ESQT-140-03-M-Q-360 esqt_th.pdf
Hersteller: Samtec Inc.
Description: CONN SOCKET 160P 0.079 GOLD PCB
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Forked
Operating Temperature: -55°C ~ 125°C
Style: Board to Board or Cable
Number of Positions: 160
Mounting Type: Through Hole
Current Rating (Amps): 4.5A per Contact
Connector Type: Elevated Socket
Packaging: Tube
Number of Rows: 4
Row Spacing - Mating: 0.079" (2.00mm)
Insulation Height: 0.360" (9.14mm)
Contact Length - Post: 0.098" (2.50mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Produkt ist nicht verfügbar
Mindestbestellmenge: 7 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
ESQT-140-03-M-Q-360 esqt_th-1369934.pdf
Hersteller: Samtec
Headers & Wire Housings 2.00 mm FleXYZ Flexible Elevated Socket Strip
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH