auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 9.13 EUR |
| 28+ | 8.25 EUR |
| 56+ | 7.67 EUR |
| 112+ | 7.3 EUR |
| 504+ | 7.09 EUR |
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Technische Details ESW-115-23-L-D Samtec
Description: CONN SOCKET 30POS 0.1 GOLD PCB, Packaging: Tube, Connector Type: Elevated Socket, Voltage Rating: 550VAC, Current Rating (Amps): 5.2A per Contact, Mounting Type: Through Hole, Number of Positions: 30, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Contact Length - Post: 0.190" (4.83mm), Insulation Height: 0.535" (13.60mm), Row Spacing - Mating: 0.100" (2.54mm), Number of Rows: 2.
Weitere Produktangebote ESW-115-23-L-D nach Preis ab 9.49 EUR bis 11.99 EUR
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ESW-115-23-L-D | Hersteller : Samtec Inc. |
 Description: CONN SOCKET 30POS 0.1 GOLD PCBPackaging: Tube Connector Type: Elevated Socket Voltage Rating: 550VAC Current Rating (Amps): 5.2A per Contact Mounting Type: Through Hole Number of Positions: 30 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Forked Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Contact Length - Post: 0.190" (4.83mm) Insulation Height: 0.535" (13.60mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
auf Bestellung 164 Stücke: Lieferzeit 10-14 Tag (e) |
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