Technische Details ESW-132-33-G-D Samtec
Description: CONN SOCKET 64POS 0.1 GOLD PCB, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Insulation Color: Black, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Forked, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Positions: 64, Mounting Type: Through Hole, Current Rating (Amps): 5.2A per Contact, Voltage Rating: 550VAC, Connector Type: Elevated Socket, Packaging: Tube, Number of Rows: 2, Row Spacing - Mating: 0.100" (2.54mm), Insulation Height: 0.635" (16.13mm), Contact Length - Post: 0.090" (2.29mm), Part Status: Active, Contact Finish - Post: Gold.
Weitere Produktangebote ESW-132-33-G-D nach Preis ab 16.55 EUR bis 32.24 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
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ESW-132-33-G-D | Samtec Inc. |
 Description: CONN SOCKET 64POS 0.1 GOLD PCBContact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Forked Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 64 Mounting Type: Through Hole Current Rating (Amps): 5.2A per Contact Voltage Rating: 550VAC Connector Type: Elevated Socket Packaging: Tube Number of Rows: 2 Row Spacing - Mating: 0.100" (2.54mm) Insulation Height: 0.635" (16.13mm) Contact Length - Post: 0.090" (2.29mm) Part Status: Active Contact Finish - Post: Gold |
auf Bestellung 412 Stücke: Lieferzeit 10-14 Tag (e) |
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ESW-132-33-G-D | SAMTEC |
Description: SAMTEC - ESW-132-33-G-D - Stapelbare Leiterplattensteckverbinder, erhöht, ESW Series, 64 Kontakt(e), 2.54 mm, Buchsenleiste tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y Ausführung: Buchse Steckverbindermontage: Durchsteckmontage Anzahl der Kontakte: 64Kontakt(e) SVHC: No SVHC (04-Feb-2026) Steckverbindersysteme: Board-to-Board Steckverbinder: Buchsenleiste Stapelhöhe: 2.54mm Produktpalette: ESW Series productTraceability: No Kontaktanschluss: Lötanschluss usEccn: EAR99 Anzahl der Reihen: 2Reihe(n) Rastermaß: 2.54mm |
auf Bestellung 8 Stücke: Lieferzeit 14-21 Tag (e) |
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| ESW-132-33-G-D |
|
Hersteller: Samtec Inc.
Description: CONN SOCKET 64POS 0.1 GOLD PCB
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Forked
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 64
Mounting Type: Through Hole
Current Rating (Amps): 5.2A per Contact
Voltage Rating: 550VAC
Connector Type: Elevated Socket
Packaging: Tube
Number of Rows: 2
Row Spacing - Mating: 0.100" (2.54mm)
Insulation Height: 0.635" (16.13mm)
Contact Length - Post: 0.090" (2.29mm)
Part Status: Active
Contact Finish - Post: Gold
Description: CONN SOCKET 64POS 0.1 GOLD PCB
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Forked
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 64
Mounting Type: Through Hole
Current Rating (Amps): 5.2A per Contact
Voltage Rating: 550VAC
Connector Type: Elevated Socket
Packaging: Tube
Number of Rows: 2
Row Spacing - Mating: 0.100" (2.54mm)
Insulation Height: 0.635" (16.13mm)
Contact Length - Post: 0.090" (2.29mm)
Part Status: Active
Contact Finish - Post: Gold
auf Bestellung 412 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 24.92 EUR |
| 10+ | 20.31 EUR |
| 100+ | 16.55 EUR |
| ESW-132-33-G-D |
|
Hersteller: SAMTEC
Description: SAMTEC - ESW-132-33-G-D - Stapelbare Leiterplattensteckverbinder, erhöht, ESW Series, 64 Kontakt(e), 2.54 mm, Buchsenleiste
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Ausführung: Buchse
Steckverbindermontage: Durchsteckmontage
Anzahl der Kontakte: 64Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Board-to-Board
Steckverbinder: Buchsenleiste
Stapelhöhe: 2.54mm
Produktpalette: ESW Series
productTraceability: No
Kontaktanschluss: Lötanschluss
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2.54mm
Description: SAMTEC - ESW-132-33-G-D - Stapelbare Leiterplattensteckverbinder, erhöht, ESW Series, 64 Kontakt(e), 2.54 mm, Buchsenleiste
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Ausführung: Buchse
Steckverbindermontage: Durchsteckmontage
Anzahl der Kontakte: 64Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Board-to-Board
Steckverbinder: Buchsenleiste
Stapelhöhe: 2.54mm
Produktpalette: ESW Series
productTraceability: No
Kontaktanschluss: Lötanschluss
usEccn: EAR99
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2.54mm
auf Bestellung 8 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8+ | 32.24 EUR |