
EXB-SN96.5AG3.0CU0.5-0.5LB Chip Quik Inc.

Description: SOLDER BAR SN96.5/AG3.0/CU0.5 0.
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Bar Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Bar, 0.5 lb (227g)
Process: Lead Free
Part Status: Active
auf Bestellung 31 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 54.44 EUR |
Produktrezensionen
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Technische Details EXB-SN96.5AG3.0CU0.5-0.5LB Chip Quik Inc.
Description: SOLDER BAR SN96.5/AG3.0/CU0.5 0., Packaging: Bulk, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Type: Bar Solder, Melting Point: 423 ~ 428°F (217 ~ 220°C), Form: Bar, 0.5 lb (227g), Process: Lead Free, Part Status: Active.