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FEMC004GSTE9-T14-17

FEMC004GSTE9-T14-17 Flexxon Pte Ltd

FLEXXON%20eMMC%205.1%20pSLC%20%28XTRA%20III%20153ball%29%20SPEC%20V1.7.pdf
Hersteller: Flexxon Pte Ltd
Description: IC FLASH 32GBIT EMMC 153FBGA
Packaging: Tray
Package / Case: 153-VFBGA
Mounting Type: Surface Mount
Memory Size: 32Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (pSLC)
Clock Frequency: 200 MHz
Memory Format: FLASH
Supplier Device Package: 153-FBGA (11.5x13)
Memory Interface: eMMC_5.1
Memory Organization: 4G x 8
auf Bestellung 828 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+15.24 EUR
10+14.16 EUR
25+13.72 EUR
50+13.39 EUR
100+13.07 EUR
250+12.64 EUR
500+12.32 EUR
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Technische Details FEMC004GSTE9-T14-17 Flexxon Pte Ltd

Description: IC FLASH 32GBIT EMMC 153FBGA, Packaging: Tray, Package / Case: 153-VFBGA, Mounting Type: Surface Mount, Memory Size: 32Gbit, Memory Type: Non-Volatile, Operating Temperature: -40°C ~ 85°C (TA), Voltage - Supply: 2.7V ~ 3.6V, Technology: FLASH - NAND (pSLC), Clock Frequency: 200 MHz, Memory Format: FLASH, Supplier Device Package: 153-FBGA (11.5x13), Memory Interface: eMMC_5.1, Memory Organization: 4G x 8.