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FEMC008GSTE9-T14-16

FEMC008GSTE9-T14-16 Flexxon Pte Ltd

FLEXXON%20eMMC%205.1%20MLC%20%28XTRA%20III%20153ball%29%20SPEC%20V1.9.pdf
Hersteller: Flexxon Pte Ltd
Description: IC FLASH 64MBIT EMMC 153FBGA
Memory Interface: eMMC_5.1
Supplier Device Package: 153-FBGA (11.5x13)
Memory Format: FLASH
Clock Frequency: 200 MHz
Technology: FLASH - NAND (MLC)
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 64Gbit
Mounting Type: Surface Mount
Package / Case: 153-VFBGA
Packaging: Tray
Memory Organization: 8G x 8
auf Bestellung 1554 Stücke:
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10+17.19 EUR
25+16.66 EUR
50+16.26 EUR
152+15.62 EUR
304+15.23 EUR
608+14.85 EUR
1064+14.54 EUR
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Technische Details FEMC008GSTE9-T14-16 Flexxon Pte Ltd

Description: IC FLASH 64MBIT EMMC 153FBGA, Memory Interface: eMMC_5.1, Supplier Device Package: 153-FBGA (11.5x13), Memory Format: FLASH, Clock Frequency: 200 MHz, Technology: FLASH - NAND (MLC), Voltage - Supply: 2.7V ~ 3.6V, Operating Temperature: -40°C ~ 85°C (TA), Memory Type: Non-Volatile, Memory Size: 64Gbit, Mounting Type: Surface Mount, Package / Case: 153-VFBGA, Packaging: Tray, Memory Organization: 8G x 8.