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FEMC016GSTE9-T14-26

FEMC016GSTE9-T14-26 Flexxon Pte Ltd

FLEXXON%20eMMC..%205.1%20MLC%20%28XTRA%20III%20153ball%29%20SPEC%20V1.9.pdf
Hersteller: Flexxon Pte Ltd
Description: IC FLASH 128GBIT EMMC 153FBGA
Memory Organization: 16G x 8
Memory Interface: eMMC_5.1
Supplier Device Package: 153-FBGA (11.5x13)
Memory Format: FLASH
Clock Frequency: 200 MHz
Technology: FLASH - NAND (MLC)
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Gbit
Mounting Type: Surface Mount
Package / Case: 153-VFBGA
Packaging: Tray
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Technische Details FEMC016GSTE9-T14-26 Flexxon Pte Ltd

Description: IC FLASH 128GBIT EMMC 153FBGA, Memory Organization: 16G x 8, Memory Interface: eMMC_5.1, Supplier Device Package: 153-FBGA (11.5x13), Memory Format: FLASH, Clock Frequency: 200 MHz, Technology: FLASH - NAND (MLC), Voltage - Supply: 2.7V ~ 3.6V, Operating Temperature: -40°C ~ 85°C (TA), Memory Type: Non-Volatile, Memory Size: 128Gbit, Mounting Type: Surface Mount, Package / Case: 153-VFBGA, Packaging: Tray.