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FI-XB30SSLA-HF15

FI-XB30SSLA-HF15 JAE Electronics


FI-XB30SSLA-HF15.pdf Hersteller: JAE Electronics
Description: CONN RCPT 30P 0.039 GOLD SMD R/A
Features: Grounding Pins, Shielded, Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle
Voltage Rating: 200V
Current Rating (Amps): 1A per Contact
Mounting Type: Board Cutout, Bottom Mount, Surface Mount, Right Angle
Number of Positions: 30
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 80°C
Contact Type: Non-Gendered
Fastening Type: Friction Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Beige
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.90µin (0.099µm)
Contact Finish - Post: Tin
Part Status: Active
Number of Rows: 1
auf Bestellung 2279 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+28.81 EUR
10+ 24.97 EUR
100+ 20.58 EUR
500+ 18.8 EUR
Produktrezensionen
Produktbewertung abgeben

Technische Details FI-XB30SSLA-HF15 JAE Electronics

Description: CONN RCPT 30P 0.039 GOLD SMD R/A, Features: Grounding Pins, Shielded, Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Voltage Rating: 200V, Current Rating (Amps): 1A per Contact, Mounting Type: Board Cutout, Bottom Mount, Surface Mount, Right Angle, Number of Positions: 30, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 80°C, Contact Type: Non-Gendered, Fastening Type: Friction Lock, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Beige, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.90µin (0.099µm), Contact Finish - Post: Tin, Part Status: Active, Number of Rows: 1.

Weitere Produktangebote FI-XB30SSLA-HF15 nach Preis ab 27.95 EUR bis 42.64 EUR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
FI-XB30SSLA-HF15 FI-XB30SSLA-HF15 Hersteller : JAE Electronics JAEIS04317_1-2550437.pdf FFC & FPC Connectors PCB 2 CBL CONN BTM MNT 30 SKT CONT R/A
auf Bestellung 162 Stücke:
Lieferzeit 14-28 Tag (e)
Anzahl Preis ohne MwSt
2+42.64 EUR
10+ 37.13 EUR
25+ 34.66 EUR
50+ 34.35 EUR
100+ 30.47 EUR
200+ 29.46 EUR
500+ 27.95 EUR
Mindestbestellmenge: 2
FI-XB30SSLA-HF15 FI-XB30SSLA-HF15 Hersteller : JAE Electronics FI-XB30SSLA-HF15.pdf Description: CONN RCPT 30P 0.039 GOLD SMD R/A
Features: Grounding Pins, Shielded, Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Voltage Rating: 200V
Current Rating (Amps): 1A per Contact
Mounting Type: Board Cutout, Bottom Mount, Surface Mount, Right Angle
Number of Positions: 30
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 80°C
Contact Type: Non-Gendered
Fastening Type: Friction Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Beige
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.90µin (0.099µm)
Contact Finish - Post: Tin
Part Status: Active
Number of Rows: 1
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