
FLE-110-01-G-DV-A-P Samtec

Board to Board & Mezzanine Connectors Cost Effective Surface Mount Socket, 0.050" Pitch
auf Bestellung 45 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 6.02 EUR |
25+ | 5.46 EUR |
45+ | 5.05 EUR |
90+ | 4.82 EUR |
540+ | 4.75 EUR |
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Technische Details FLE-110-01-G-DV-A-P Samtec
Description: CONN RCPT 20POS 0.05 GOLD SMD, Packaging: Tube, Features: Board Guide, Pick and Place, Connector Type: Receptacle, Current Rating (Amps): 2A per Contact, Mounting Type: Surface Mount, Number of Positions: 20, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Gold, Insulation Height: 0.172" (4.37mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 2.
Weitere Produktangebote FLE-110-01-G-DV-A-P nach Preis ab 7.72 EUR bis 7.72 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
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FLE-110-01-G-DV-A-P | Hersteller : Samtec Inc. |
![]() Packaging: Tube Features: Board Guide, Pick and Place Connector Type: Receptacle Current Rating (Amps): 2A per Contact Mounting Type: Surface Mount Number of Positions: 20 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Insulation Height: 0.172" (4.37mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 2 |
auf Bestellung 68 Stücke: Lieferzeit 10-14 Tag (e) |
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FLE-110-01-G-DV-A-P | Hersteller : Samtec |
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Produkt ist nicht verfügbar |
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FLE-110-01-G-DV-A-P | Hersteller : Samtec |
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Produkt ist nicht verfügbar |