
FLE-130-01-G-DV-P Samtec

Board to Board & Mezzanine Connectors Cost Effective Surface Mount Socket, 0.050" Pitch
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 12.37 EUR |
10+ | 11.56 EUR |
30+ | 10.68 EUR |
60+ | 9.93 EUR |
105+ | 9.17 EUR |
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Technische Details FLE-130-01-G-DV-P Samtec
Description: CONN RCPT 60POS 0.05 GOLD SMD, Packaging: Tube, Features: Pick and Place, Connector Type: Receptacle, Current Rating (Amps): 2A per Contact, Mounting Type: Surface Mount, Number of Positions: 60, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Gold, Insulation Height: 0.172" (4.37mm), Row Spacing - Mating: 0.050" (1.27mm), Number of Rows: 2.
Weitere Produktangebote FLE-130-01-G-DV-P nach Preis ab 11.72 EUR bis 14.38 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
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FLE-130-01-G-DV-P | Hersteller : Samtec Inc. |
![]() Packaging: Tube Features: Pick and Place Connector Type: Receptacle Current Rating (Amps): 2A per Contact Mounting Type: Surface Mount Number of Positions: 60 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Insulation Height: 0.172" (4.37mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 2 |
auf Bestellung 86 Stücke: Lieferzeit 10-14 Tag (e) |
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FLE-130-01-G-DV-P | Hersteller : Samtec |
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Produkt ist nicht verfügbar |
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FLE-130-01-G-DV-P | Hersteller : Samtec |
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Produkt ist nicht verfügbar |