FS32R294JCK0MJDT NXP USA Inc.
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
RAM Size: 5.5M x 8
Program Memory Type: ROMless
Core Processor: e200z4, e200z7
Core Size: 32-Bit Dual-Core
Connectivity: CANbus, Ethernet, FlexRay, QSPI, SPI
Peripherals: Temp Sensor
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
RAM Size: 5.5M x 8
Program Memory Type: ROMless
Core Processor: e200z4, e200z7
Core Size: 32-Bit Dual-Core
Connectivity: CANbus, Ethernet, FlexRay, QSPI, SPI
Peripherals: Temp Sensor
Supplier Device Package: 269-LFBGA (14x14)
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Technische Details FS32R294JCK0MJDT NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT, Packaging: Tray, Package / Case: 269-LFBGA, Mounting Type: Surface Mount, RAM Size: 5.5M x 8, Program Memory Type: ROMless, Core Processor: e200z4, e200z7, Core Size: 32-Bit Dual-Core, Connectivity: CANbus, Ethernet, FlexRay, QSPI, SPI, Peripherals: Temp Sensor, Supplier Device Package: 269-LFBGA (14x14).
Weitere Produktangebote FS32R294JCK0MJDT
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| FS32R294JCK0MJDT | Hersteller : NXP Semiconductors | NXP Semiconductors S32R29 multicore Power Architecture, 266 MHz, ISO 26262, AEC-Q100, CSE3 Security |
Produkt ist nicht verfügbar |