FSI-110-03-G-D-AB Samtec
| Anzahl | Preis |
|---|---|
| 1+ | 11.9 EUR |
| 10+ | 10.56 EUR |
| 25+ | 10.54 EUR |
| 50+ | 10.01 EUR |
| 100+ | 9.01 EUR |
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Technische Details FSI-110-03-G-D-AB Samtec
Description: CONN STACKING 20POS SMD GOLD, Number of Rows: 2, Contact Finish Thickness: 10.0µin (0.25µm), Height Above Board: 0.118" (3.00mm), Pitch: 0.039" (1.00mm), Number of Positions: 20, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Stacking Compression, Features: Board Guide, Packaging: Tube.
Weitere Produktangebote FSI-110-03-G-D-AB nach Preis ab 10 EUR bis 12.55 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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FSI-110-03-G-D-AB | Samtec Inc. |
Description: CONN STACKING 20POS SMD GOLDNumber of Rows: 2 Contact Finish Thickness: 10.0µin (0.25µm) Height Above Board: 0.118" (3.00mm) Pitch: 0.039" (1.00mm) Number of Positions: 20 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Stacking Compression Features: Board Guide Packaging: Tube |
auf Bestellung 34 Stücke: Lieferzeit 10-14 Tag (e) |
|
| FSI-110-03-G-D-AB |
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Hersteller: Samtec Inc.
Description: CONN STACKING 20POS SMD GOLD
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.118" (3.00mm)
Pitch: 0.039" (1.00mm)
Number of Positions: 20
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Stacking Compression
Features: Board Guide
Packaging: Tube
Description: CONN STACKING 20POS SMD GOLD
Number of Rows: 2
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.118" (3.00mm)
Pitch: 0.039" (1.00mm)
Number of Positions: 20
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Stacking Compression
Features: Board Guide
Packaging: Tube
auf Bestellung 34 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 12.55 EUR |
| 10+ | 10.67 EUR |
| 25+ | 10 EUR |



