| Anzahl | Privatkunde |
|---|---|
| 1+ | 9.32 EUR |
| 30+ | 8.92 EUR |
| 60+ | 8.4 EUR |
| 120+ | 7.71 EUR |
| 510+ | 6.97 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details FTSH-115-01-L-DV-K Samtec
Description: CONN HEADER SMD 30POS 1.27MM, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black, Contact Material: Phosphor Bronze, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Male Pin, Operating Temperature: -55°C ~ 125°C, Style: Board to Board or Cable, Number of Rows: 2, Number of Positions: 30, Contact Length - Mating: 0.120" (3.05mm), Row Spacing - Mating: 0.050" (1.27mm), Insulation Material: Liquid Crystal Polymer (LCP), Shrouding: Unshrouded, Insulation Height: 0.099" (2.51mm), Contact Shape: Square, Mounting Type: Surface Mount, Current Rating (Amps): 3.4A per Contact, Connector Type: Header, Cuttable, Features: Keying Shroud, Packaging: Tube.
Weitere Produktangebote FTSH-115-01-L-DV-K nach Preis ab 8.39 EUR bis 10.12 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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FTSH-115-01-L-DV-K | Samtec Inc. |
 Description: CONN HEADER SMD 30POS 1.27MMContact Finish - Post: Tin Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.050" (1.27mm) Insulation Color: Black Contact Material: Phosphor Bronze Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Male Pin Operating Temperature: -55°C ~ 125°C Style: Board to Board or Cable Number of Rows: 2 Number of Positions: 30 Contact Length - Mating: 0.120" (3.05mm) Row Spacing - Mating: 0.050" (1.27mm) Insulation Material: Liquid Crystal Polymer (LCP) Shrouding: Unshrouded Insulation Height: 0.099" (2.51mm) Contact Shape: Square Mounting Type: Surface Mount Current Rating (Amps): 3.4A per Contact Connector Type: Header, Cuttable Features: Keying Shroud Packaging: Tube |
auf Bestellung 383 Stücke: Lieferzeit 10-14 Tag (e) |
|
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 |
FTSH-115-01-L-DV-K | SAMTEC |
Description: SAMTEC - FTSH-115-01-L-DV-K - Stiftleiste, Board-to-Board, Wire-to-Board, 1.27 mm, 2 Reihe(n), 30 Kontakt(e) tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze usEccn: EAR99 Steckverbinderkragen: Ohne Kragen Anzahl der Kontakte: 30Contacts euEccn: NLR Steckverbindersysteme: Board-to-Board, Wire-to-Board Produktpalette: FTSH productTraceability: No Kontaktanschluss: Oberflächenmontage Anzahl der Reihen: 2Reihe(n) Rastermaß: 1.27mm SVHC: No SVHC (23-Jan-2024) |
auf Bestellung 11 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| FTSH-115-01-L-DV-K |
|
Hersteller: Samtec Inc.
Description: CONN HEADER SMD 30POS 1.27MM
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Contact Material: Phosphor Bronze
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Operating Temperature: -55°C ~ 125°C
Style: Board to Board or Cable
Number of Rows: 2
Number of Positions: 30
Contact Length - Mating: 0.120" (3.05mm)
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Shrouding: Unshrouded
Insulation Height: 0.099" (2.51mm)
Contact Shape: Square
Mounting Type: Surface Mount
Current Rating (Amps): 3.4A per Contact
Connector Type: Header, Cuttable
Features: Keying Shroud
Packaging: Tube
Description: CONN HEADER SMD 30POS 1.27MM
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Contact Material: Phosphor Bronze
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Operating Temperature: -55°C ~ 125°C
Style: Board to Board or Cable
Number of Rows: 2
Number of Positions: 30
Contact Length - Mating: 0.120" (3.05mm)
Row Spacing - Mating: 0.050" (1.27mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Shrouding: Unshrouded
Insulation Height: 0.099" (2.51mm)
Contact Shape: Square
Mounting Type: Surface Mount
Current Rating (Amps): 3.4A per Contact
Connector Type: Header, Cuttable
Features: Keying Shroud
Packaging: Tube
auf Bestellung 383 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 10.12 EUR |
| 25+ | 9.7 EUR |
| 50+ | 9.12 EUR |
| 100+ | 8.39 EUR |
| FTSH-115-01-L-DV-K |
|
Hersteller: SAMTEC
Description: SAMTEC - FTSH-115-01-L-DV-K - Stiftleiste, Board-to-Board, Wire-to-Board, 1.27 mm, 2 Reihe(n), 30 Kontakt(e)
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
usEccn: EAR99
Steckverbinderkragen: Ohne Kragen
Anzahl der Kontakte: 30Contacts
euEccn: NLR
Steckverbindersysteme: Board-to-Board, Wire-to-Board
Produktpalette: FTSH
productTraceability: No
Kontaktanschluss: Oberflächenmontage
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1.27mm
SVHC: No SVHC (23-Jan-2024)
Description: SAMTEC - FTSH-115-01-L-DV-K - Stiftleiste, Board-to-Board, Wire-to-Board, 1.27 mm, 2 Reihe(n), 30 Kontakt(e)
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
usEccn: EAR99
Steckverbinderkragen: Ohne Kragen
Anzahl der Kontakte: 30Contacts
euEccn: NLR
Steckverbindersysteme: Board-to-Board, Wire-to-Board
Produktpalette: FTSH
productTraceability: No
Kontaktanschluss: Oberflächenmontage
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1.27mm
SVHC: No SVHC (23-Jan-2024)
auf Bestellung 11 Stücke:
Lieferzeit 14-21 Tag (e)