FX30A-3S-3.81DS Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 3POS 0.15 GOLD PCB R/A
Insulation Height: 0.433" (11.00mm)
Contact Finish Thickness - Mating: 3.90µin (0.099µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.150" (3.81mm)
Insulation Color: Black
Termination: Solder
Number of Positions Loaded: All
Style: Board to Board
Number of Positions: 3
Mounting Type: Through Hole, Right Angle
Current Rating (Amps): 15A
Number of Rows: 1
Voltage Rating: 250V
Connector Type: Receptacle
Features: Board Guide, Board Lock
Packaging: Tray
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Technische Details FX30A-3S-3.81DS Hirose Electric Co Ltd
Description: CONN RCPT 3POS 0.15 GOLD PCB R/A, Insulation Height: 0.433" (11.00mm), Contact Finish Thickness - Mating: 3.90µin (0.099µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.150" (3.81mm), Insulation Color: Black, Termination: Solder, Number of Positions Loaded: All, Style: Board to Board, Number of Positions: 3, Mounting Type: Through Hole, Right Angle, Current Rating (Amps): 15A, Number of Rows: 1, Voltage Rating: 250V, Connector Type: Receptacle, Features: Board Guide, Board Lock, Packaging: Tray.
Weitere Produktangebote FX30A-3S-3.81DS
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| FX30A-3S-3.81DS | Hersteller : Hirose Connector |
 Board to Board & Mezzanine Connectors |
Produkt ist nicht verfügbar |