GD25B32ETIGR GigaDevice Semiconductor (HK) Limited
Hersteller: GigaDevice Semiconductor (HK) LimitedDescription: 32MBIT, 3.3V, SOP8 150MIL, INDUS
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOP
Part Status: Active
Write Cycle Time - Word, Page: 70µs, 2.4ms
Memory Interface: SPI - Quad I/O
Access Time: 7 ns
Memory Organization: 4M x 8
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 3000+ | 1.12 EUR |
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Technische Details GD25B32ETIGR GigaDevice Semiconductor (HK) Limited
Description: 32MBIT, 3.3V, SOP8 150MIL, INDUS, Packaging: Tape & Reel (TR), Package / Case: 8-SOIC (0.154", 3.90mm Width), Mounting Type: Surface Mount, Memory Size: 32Mbit, Memory Type: Non-Volatile, Operating Temperature: -40°C ~ 85°C (TA), Voltage - Supply: 2.7V ~ 3.6V, Technology: FLASH - NOR (SLC), Clock Frequency: 133 MHz, Memory Format: FLASH, Supplier Device Package: 8-SOP, Part Status: Active, Write Cycle Time - Word, Page: 70µs, 2.4ms, Memory Interface: SPI - Quad I/O, Access Time: 7 ns, Memory Organization: 4M x 8.
Weitere Produktangebote GD25B32ETIGR nach Preis ab 1.19 EUR bis 1.58 EUR
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| GD25B32ETIGR | Hersteller : GigaDevice Semiconductor (HK) Limited |
Description: 32MBIT, 3.3V, SOP8 150MIL, INDUS Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Memory Size: 32Mbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NOR (SLC) Clock Frequency: 133 MHz Memory Format: FLASH Supplier Device Package: 8-SOP Part Status: Active Write Cycle Time - Word, Page: 70µs, 2.4ms Memory Interface: SPI - Quad I/O Access Time: 7 ns Memory Organization: 4M x 8 |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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