GD25LQ255EWIGR GigaDevice Semiconductor (HK) Limited
Hersteller: GigaDevice Semiconductor (HK) LimitedDescription: IC FLASH 256MBIT SPI/QUAD
Packaging: Cut Tape (CT)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (5x6)
Part Status: Active
Write Cycle Time - Word, Page: 60µs, 2.4ms
Memory Interface: SPI - Quad I/O, QPI
Access Time: 6 ns
Memory Organization: 32M x 8
auf Bestellung 2564 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 4+ | 5.28 EUR |
| 10+ | 4.92 EUR |
| 25+ | 4.78 EUR |
| 50+ | 4.67 EUR |
| 100+ | 4.56 EUR |
| 250+ | 4.41 EUR |
| 500+ | 4.31 EUR |
| 1000+ | 4.20 EUR |
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Technische Details GD25LQ255EWIGR GigaDevice Semiconductor (HK) Limited
Description: IC FLASH 256MBIT SPI/QUAD, Packaging: Tape & Reel (TR), Package / Case: 8-WDFN Exposed Pad, Mounting Type: Surface Mount, Memory Size: 256Mbit, Memory Type: Non-Volatile, Operating Temperature: -40°C ~ 85°C (TA), Voltage - Supply: 1.65V ~ 2V, Technology: FLASH - NOR (SLC), Clock Frequency: 133 MHz, Memory Format: FLASH, Supplier Device Package: 8-WSON (5x6), Part Status: Active, Write Cycle Time - Word, Page: 60µs, 2.4ms, Memory Interface: SPI - Quad I/O, QPI, Access Time: 6 ns, Memory Organization: 32M x 8.
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GD25LQ255EWIGR | Hersteller : GigaDevice Semiconductor (HK) Limited |
Description: IC FLASH 256MBIT SPI/QUAD Packaging: Tape & Reel (TR) Package / Case: 8-WDFN Exposed Pad Mounting Type: Surface Mount Memory Size: 256Mbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.65V ~ 2V Technology: FLASH - NOR (SLC) Clock Frequency: 133 MHz Memory Format: FLASH Supplier Device Package: 8-WSON (5x6) Part Status: Active Write Cycle Time - Word, Page: 60µs, 2.4ms Memory Interface: SPI - Quad I/O, QPI Access Time: 6 ns Memory Organization: 32M x 8 |
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