Technische Details HD6417760BL200AV RENESAS
Description: IC MCU 32BIT ROMLESS 256LFBGA, Number of I/O: 69, Part Status: Obsolete, Supplier Device Package: 256-LFBGA (17x17), Peripherals: DMA, LCD, POR, WDT, Connectivity: Audio Codec, CANbus, EBI/EMI, FIFO, I2C, MFI, Memory Card, SCI, Serial Sound, SIM, SPI, USB, Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V, Core Size: 32-Bit, Data Converters: A/D 4x10b, Core Processor: SH-4, Program Memory Type: ROMless, Oscillator Type: Internal, Operating Temperature: -40°C ~ 85°C (TA), RAM Size: 48K x 8, Speed: 200MHz, Mounting Type: Surface Mount, Package / Case: 256-LFBGA, Packaging: Tray, DigiKey Programmable: Not Verified.
Weitere Produktangebote HD6417760BL200AV
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HD6417760BL200AV | Hersteller : Renesas Electronics Corporation |
 Description: IC MCU 32BIT ROMLESS 256LFBGANumber of I/O: 69 Part Status: Obsolete Supplier Device Package: 256-LFBGA (17x17) Peripherals: DMA, LCD, POR, WDT Connectivity: Audio Codec, CANbus, EBI/EMI, FIFO, I2C, MFI, Memory Card, SCI, Serial Sound, SIM, SPI, USB Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V Core Size: 32-Bit Data Converters: A/D 4x10b Core Processor: SH-4 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 48K x 8 Speed: 200MHz Mounting Type: Surface Mount Package / Case: 256-LFBGA Packaging: Tray DigiKey Programmable: Not Verified |
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