HDAM-11-17.0-S-13-1-P Samtec Inc.
Hersteller: Samtec Inc.
Description: 2.00 MM X 1.20 MM HD MEZZ RUGGED
Part Status: Active
Packaging: Tray
Number of Rows: 13
Mated Stacking Heights: 25mm, 35mm
Contact Finish Thickness: 30.0µin (0.76µm)
Height Above Board: 0.880" (22.35mm)
Pitch: 0.047" (1.20mm)
Number of Positions: 143
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: High Density Array, Male
Features: Board Guide, Pick and Place
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Technische Details HDAM-11-17.0-S-13-1-P Samtec Inc.
Description: 2.00 MM X 1.20 MM HD MEZZ RUGGED, Part Status: Active, Packaging: Tray, Number of Rows: 13, Mated Stacking Heights: 25mm, 35mm, Contact Finish Thickness: 30.0µin (0.76µm), Height Above Board: 0.880" (22.35mm), Pitch: 0.047" (1.20mm), Number of Positions: 143, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: High Density Array, Male, Features: Board Guide, Pick and Place.
Weitere Produktangebote HDAM-11-17.0-S-13-1-P
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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HDAM-11-17.0-S-13-1-P | Samtec |
Board to Board & Mezzanine Connectors 2.00 mm x 1.20 mm HD Mezz Rugged |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| HDAM-11-17.0-S-13-1-P |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors 2.00 mm x 1.20 mm HD Mezz Rugged
Board to Board & Mezzanine Connectors 2.00 mm x 1.20 mm HD Mezz Rugged
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH