HDAM-11-17.0-S-13-2-P Samtec
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Technische Details HDAM-11-17.0-S-13-2-P Samtec
Description: 2.00 MM X 1.20 MM HD MEZZ RUGGED, Features: Board Guide, Pick and Place, Packaging: Tray, Connector Type: High Density Array, Male, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 143, Pitch: 0.047" (1.20mm), Height Above Board: 0.880" (22.35mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 25mm, 35mm, Number of Rows: 13.
Weitere Produktangebote HDAM-11-17.0-S-13-2-P
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| HDAM-11-17.0-S-13-2-P | Hersteller : Samtec Inc. |
 Description: 2.00 MM X 1.20 MM HD MEZZ RUGGEDFeatures: Board Guide, Pick and Place Packaging: Tray Connector Type: High Density Array, Male Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 143 Pitch: 0.047" (1.20mm) Height Above Board: 0.880" (22.35mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 25mm, 35mm Number of Rows: 13 |
Produkt ist nicht verfügbar |
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HDAM-11-17.0-S-13-2-P | Hersteller : Samtec |
Board to Board & Mezzanine Connectors 2.00 mm x 1.20 mm HD Mezz Rugged |
Produkt ist nicht verfügbar |