HDR-SOICW-80 Chip Quik
Hersteller: Chip Quik
Headers & Wire Housings SMT to SOIC-Wide Header (1.27mm Pitch, 80 Pin, for 300 mil IC body) (SOIC80W/SOIC-80W)
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Technische Details HDR-SOICW-80 Chip Quik
Description: SMT TO SOIC-WIDE HEADER (1.27MM, Features: Closed Frame, Packaging: Bulk, Mounting Type: Surface Mount, Type: SOIC, Operating Temperature: -40°C ~ 130°C, Number of Positions or Pins (Grid): 80 (2 x 40), Termination: Solder, Housing Material: Polyamide (PA6T), Nylon 6T, Glass Filled, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 39.4µin (1.00µm), Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 39.4µin (1.00µm).
Weitere Produktangebote HDR-SOICW-80 nach Preis ab 11.23 EUR bis 16.62 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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HDR-SOICW-80 | Chip Quik Inc. |
Description: SMT TO SOIC-WIDE HEADER (1.27MM Features: Closed Frame Packaging: Bulk Mounting Type: Surface Mount Type: SOIC Operating Temperature: -40°C ~ 130°C Number of Positions or Pins (Grid): 80 (2 x 40) Termination: Solder Housing Material: Polyamide (PA6T), Nylon 6T, Glass Filled Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 39.4µin (1.00µm) Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 39.4µin (1.00µm) |
auf Bestellung 192 Stücke: Lieferzeit 10-14 Tag (e) |
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| HDR-SOICW-80 |
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Hersteller: Chip Quik Inc.
Description: SMT TO SOIC-WIDE HEADER (1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: SOIC
Operating Temperature: -40°C ~ 130°C
Number of Positions or Pins (Grid): 80 (2 x 40)
Termination: Solder
Housing Material: Polyamide (PA6T), Nylon 6T, Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 39.4µin (1.00µm)
Description: SMT TO SOIC-WIDE HEADER (1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: SOIC
Operating Temperature: -40°C ~ 130°C
Number of Positions or Pins (Grid): 80 (2 x 40)
Termination: Solder
Housing Material: Polyamide (PA6T), Nylon 6T, Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 39.4µin (1.00µm)
auf Bestellung 192 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 16.62 EUR |
| 5+ | 14.26 EUR |
| 10+ | 13.41 EUR |
| 25+ | 12.45 EUR |
| 50+ | 11.8 EUR |
| 100+ | 11.23 EUR |