
HDR-SOICW-80 Chip Quik

Headers & Wire Housings SMT to SOIC-Wide Header (1.27mm Pitch, 80 Pin, for 300 mil IC body) (SOIC80W/SOIC-80W)
auf Bestellung 167 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 9.82 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HDR-SOICW-80 Chip Quik
Description: SMT TO SOIC-WIDE HEADER (1.27MM, Features: Closed Frame, Packaging: Bulk, Mounting Type: Surface Mount, Type: SOIC, Operating Temperature: -40°C ~ 130°C, Number of Positions or Pins (Grid): 80 (2 x 40), Termination: Solder, Housing Material: Polyamide (PA6T), Nylon 6T, Glass Filled, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 39.4µin (1.00µm), Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 39.4µin (1.00µm).
Weitere Produktangebote HDR-SOICW-80 nach Preis ab 9.44 EUR bis 13.97 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() |
HDR-SOICW-80 | Hersteller : Chip Quik Inc. |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Surface Mount Type: SOIC Operating Temperature: -40°C ~ 130°C Number of Positions or Pins (Grid): 80 (2 x 40) Termination: Solder Housing Material: Polyamide (PA6T), Nylon 6T, Glass Filled Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 39.4µin (1.00µm) Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 39.4µin (1.00µm) |
auf Bestellung 192 Stücke: Lieferzeit 10-14 Tag (e) |
|