
HDWM-03-60-S-D-547 Samtec

Board to Board & Mezzanine Connectors .050" X .100" Flex Stack, High-Temp Micro Board Stacker
auf Bestellung 77 Stücke:
Lieferzeit 10-14 Tag (e)
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Technische Details HDWM-03-60-S-D-547 Samtec
Description: CONN HDR 6POS 0.05 STACK T/H, Packaging: Bulk, Color: Black, Mounting Type: Through Hole, Pitch: 0.050" (1.27mm), Row Spacing: 0.100" (2.54mm), Termination: Solder, Contact Finish - Post (Mating): Gold, Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm), Number of Rows: 2, Number of Positions: 6, Length - Overall Pin: 0.825" (20.955mm), Length - Post (Mating): 0.158" (4.013mm), Length - Stack Height: 0.547" (13.894mm), Length - Tail: 0.120" (3.048mm).
Weitere Produktangebote HDWM-03-60-S-D-547 nach Preis ab 3.84 EUR bis 5.53 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
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HDWM-03-60-S-D-547 | Hersteller : Samtec Inc. |
![]() Packaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.050" (1.27mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm) Number of Rows: 2 Number of Positions: 6 Length - Overall Pin: 0.825" (20.955mm) Length - Post (Mating): 0.158" (4.013mm) Length - Stack Height: 0.547" (13.894mm) Length - Tail: 0.120" (3.048mm) |
auf Bestellung 244 Stücke: Lieferzeit 10-14 Tag (e) |
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HDWM-03-60-S-D-547 | Hersteller : Samtec Inc. |
![]() Packaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.050" (1.27mm) Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm) Number of Rows: 2 Number of Positions: 6 Length - Overall Pin: 0.825" (20.955mm) Length - Post (Mating): 0.158" (4.013mm) Length - Stack Height: 0.547" (13.894mm) Length - Tail: 0.120" (3.048mm) |
auf Bestellung 405 Stücke: Lieferzeit 10-14 Tag (e) |
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