HLE-108-02-F-DV-LC Samtec
auf Bestellung 73 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 6.41 EUR |
| 56+ | 5.21 EUR |
| 112+ | 4.42 EUR |
| 504+ | 3.92 EUR |
| 1008+ | 3.87 EUR |
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Technische Details HLE-108-02-F-DV-LC Samtec
Description: CONN RCPT 16POS 0.1 GOLD SMD, Features: Board Lock, Packaging: Tube, Connector Type: Receptacle, Voltage Rating: 400VAC, Current Rating (Amps): 4.1A per Contact, Mounting Type: Surface Mount, Number of Positions: 16, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Insulation Height: 0.144" (3.66mm), Row Spacing - Mating: 0.100" (2.54mm), Number of Rows: 2.
Weitere Produktangebote HLE-108-02-F-DV-LC nach Preis ab 6.76 EUR bis 7.44 EUR
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HLE-108-02-F-DV-LC | Hersteller : Samtec Inc. |
 Description: CONN RCPT 16POS 0.1 GOLD SMDFeatures: Board Lock Packaging: Tube Connector Type: Receptacle Voltage Rating: 400VAC Current Rating (Amps): 4.1A per Contact Mounting Type: Surface Mount Number of Positions: 16 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.144" (3.66mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
auf Bestellung 56 Stücke: Lieferzeit 10-14 Tag (e) |
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