
HLE-115-02-SM-DV-LC-P-TR Samtec
auf Bestellung 465 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 14.80 EUR |
10+ | 14.15 EUR |
100+ | 11.90 EUR |
250+ | 10.05 EUR |
475+ | 9.03 EUR |
950+ | 8.36 EUR |
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Technische Details HLE-115-02-SM-DV-LC-P-TR Samtec
Description: CONN RCPT 30POS 0.1 GOLD SMD, Features: Board Lock, Pick and Place, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Voltage Rating: 400VAC, Current Rating (Amps): 4.1A per Contact, Mounting Type: Surface Mount, Number of Positions: 30, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Insulation Height: 0.144" (3.66mm), Row Spacing - Mating: 0.100" (2.54mm), Number of Rows: 2.
Weitere Produktangebote HLE-115-02-SM-DV-LC-P-TR
Foto | Bezeichnung | Hersteller | Beschreibung |
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HLE-115-02-SM-DV-LC-P-TR | Hersteller : Samtec Inc. |
![]() Features: Board Lock, Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Voltage Rating: 400VAC Current Rating (Amps): 4.1A per Contact Mounting Type: Surface Mount Number of Positions: 30 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Insulation Height: 0.144" (3.66mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
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