HPC 252008MF-2R2M TAI-TECH Advanced Electronics Co., Ltd.
Hersteller: TAI-TECH Advanced Electronics Co., Ltd.Description: 2.2 UH SHIELDED DRUM CORE, WIREW
Packaging: Tape & Reel (TR)
Tolerance: ±20%
Package / Case: 1008 (2520 Metric)
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Wirewound
Operating Temperature: -40°C ~ 125°C
DC Resistance (DCR): 250mOhm Max
Current - Saturation (Isat): 1.4A
Inductance Frequency - Test: 1 MHz
Supplier Device Package: 1008
Height - Seated (Max): 0.031" (0.80mm)
Inductance: 2.2 µH
Current Rating (Amps): 950 mA
auf Bestellung 4000 Stücke:
Lieferzeit 21-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 2000+ | 0.21 EUR |
| 4000+ | 0.2 EUR |
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Technische Details HPC 252008MF-2R2M TAI-TECH Advanced Electronics Co., Ltd.
Description: 2.2 UH SHIELDED DRUM CORE, WIREW, Packaging: Tape & Reel (TR), Tolerance: ±20%, Package / Case: 1008 (2520 Metric), Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm), Mounting Type: Surface Mount, Shielding: Unshielded, Type: Wirewound, Operating Temperature: -40°C ~ 125°C, DC Resistance (DCR): 250mOhm Max, Current - Saturation (Isat): 1.4A, Inductance Frequency - Test: 1 MHz, Supplier Device Package: 1008, Height - Seated (Max): 0.031" (0.80mm), Inductance: 2.2 µH, Current Rating (Amps): 950 mA.
Weitere Produktangebote HPC 252008MF-2R2M nach Preis ab 0.21 EUR bis 0.49 EUR
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HPC 252008MF-2R2M | Hersteller : TAI-TECH Advanced Electronics Co., Ltd. |
Description: 2.2 UH SHIELDED DRUM CORE, WIREW Packaging: Cut Tape (CT) Tolerance: ±20% Package / Case: 1008 (2520 Metric) Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm) Mounting Type: Surface Mount Shielding: Unshielded Type: Wirewound Operating Temperature: -40°C ~ 125°C DC Resistance (DCR): 250mOhm Max Current - Saturation (Isat): 1.4A Inductance Frequency - Test: 1 MHz Supplier Device Package: 1008 Height - Seated (Max): 0.031" (0.80mm) Inductance: 2.2 µH Current Rating (Amps): 950 mA |
auf Bestellung 4000 Stücke: Lieferzeit 21-28 Tag (e) |
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