HPF-02-01-TM-S Samtec Inc.
Hersteller: Samtec Inc.
Description: .200 HI POWER SOCKET ASSEMBLY
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Style: Board to Board
Number of Positions: 2
Mounting Type: Through Hole
Connector Type: Receptacle
Number of Rows: 1
Insulation Height: 0.351" (8.92mm)
Contact Length - Post: 0.102" (2.60mm)
Part Status: Active
Contact Finish - Post: Tin
Contact Finish - Mating: Tin
Pitch - Mating: 0.200" (5.08mm)
Insulation Color: Black
Packaging: Tube
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Technische Details HPF-02-01-TM-S Samtec Inc.
Description: .200 HI POWER SOCKET ASSEMBLY, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Style: Board to Board, Number of Positions: 2, Mounting Type: Through Hole, Connector Type: Receptacle, Number of Rows: 1, Insulation Height: 0.351" (8.92mm), Contact Length - Post: 0.102" (2.60mm), Part Status: Active, Contact Finish - Post: Tin, Contact Finish - Mating: Tin, Pitch - Mating: 0.200" (5.08mm), Insulation Color: Black, Packaging: Tube.
Weitere Produktangebote HPF-02-01-TM-S
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
HPF-02-01-TM-S | Samtec |
 Power to the Board .200" Power Socket Strip |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| HPF-02-01-TM-S |
|
Hersteller: Samtec
Power to the Board .200" Power Socket Strip
Power to the Board .200" Power Socket Strip
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH