HPM-08-02-T-S Samtec Inc.
Hersteller: Samtec Inc.Description: CONN HEADER VERT 8POS 5.08MM
Packaging: Bulk
Connector Type: Header
Voltage Rating: 850VAC, 1200VDC
Mounting Type: Through Hole
Number of Positions: 8
Number of Rows: 1
Style: Board to Board
Operating Temperature: -55°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.200" (5.08mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.180" (4.57mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.800" (20.32mm)
Insulation Material: Polybutylene Terephthalate (PBT)
Contact Length - Mating: 0.520" (13.21mm)
auf Bestellung 2076 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 4+ | 5.46 EUR |
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Technische Details HPM-08-02-T-S Samtec Inc.
Description: CONN HEADER VERT 8POS 5.08MM, Packaging: Bulk, Connector Type: Header, Voltage Rating: 850VAC, 1200VDC, Mounting Type: Through Hole, Number of Positions: 8, Number of Rows: 1, Style: Board to Board, Operating Temperature: -55°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Copper Alloy, Insulation Color: Black, Pitch - Mating: 0.200" (5.08mm), Contact Finish - Mating: Tin, Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Contact Length - Post: 0.180" (4.57mm), Insulation Height: 0.100" (2.54mm), Shrouding: Unshrouded, Overall Contact Length: 0.800" (20.32mm), Insulation Material: Polybutylene Terephthalate (PBT), Contact Length - Mating: 0.520" (13.21mm).
Weitere Produktangebote HPM-08-02-T-S
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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HPM-08-02-T-S | Hersteller : SAMTEC |
Description: SAMTEC - HPM-08-02-T-S - Stiftleiste, Board-to-Board, 5.08 mm, 1 Reihe(n), 8 Kontakt(e), Durchsteckmontage, HPM tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Verzinnte Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Kupfer usEccn: EAR99 Steckverbinderkragen: Ohne Kragen Anzahl der Kontakte: 8Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Produktpalette: HPM productTraceability: No Kontaktanschluss: Durchsteckmontage Anzahl der Reihen: 1Reihe(n) Rastermaß: 5.08mm SVHC: No SVHC (23-Jan-2024) |
auf Bestellung 3 Stücke: Lieferzeit 14-21 Tag (e) |
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HPM-08-02-T-S | Hersteller : Samtec |
Headers & Wire Housings .200" Power Terminal Strip |
Produkt ist nicht verfügbar |