HSB07-202009 CUI Devices
Hersteller: CUI Devices
Description: HEAT SINK, BGA, 20 X 20 X 9 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.787" (20.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.787" (20.00mm)
Package Cooled: BGA
Attachment Method: Adhesive
Power Dissipation @ Temperature Rise: 3.1W @ 75°C
Thermal Resistance @ Forced Air Flow: 8.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 24.08°C/W
Fin Height: 0.354" (9.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, BGA, 20 X 20 X 9 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.787" (20.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.787" (20.00mm)
Package Cooled: BGA
Attachment Method: Adhesive
Power Dissipation @ Temperature Rise: 3.1W @ 75°C
Thermal Resistance @ Forced Air Flow: 8.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 24.08°C/W
Fin Height: 0.354" (9.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1068 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
12+ | 1.48 EUR |
500+ | 1.41 EUR |
1000+ | 1.28 EUR |
Produktrezensionen
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Technische Details HSB07-202009 CUI Devices
Description: HEAT SINK, BGA, 20 X 20 X 9 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.787" (20.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.787" (20.00mm), Package Cooled: BGA, Attachment Method: Adhesive, Power Dissipation @ Temperature Rise: 3.1W @ 75°C, Thermal Resistance @ Forced Air Flow: 8.60°C/W @ 200 LFM, Thermal Resistance @ Natural: 24.08°C/W, Fin Height: 0.354" (9.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB07-202009 nach Preis ab 1.54 EUR bis 2.03 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||||||||
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HSB07-202009 | Hersteller : CUI Devices | Heat Sinks heat sink, BGA, 20 x 20 x 9 mm |
auf Bestellung 1908 Stücke: Lieferzeit 14-28 Tag (e) |
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