HSB07-202009 Same Sky (Formerly CUI Devices)
Hersteller: Same Sky (Formerly CUI Devices)Description: HEAT SINK, BGA, 20 X 20 X 9 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.787" (20.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.787" (20.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 3.1W @ 75°C
Thermal Resistance @ Forced Air Flow: 8.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 24.08°C/W
Fin Height: 0.354" (9.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1093 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 14+ | 1.27 EUR |
| 25+ | 1.20 EUR |
| 50+ | 1.17 EUR |
| 100+ | 1.16 EUR |
| 250+ | 1.08 EUR |
| 500+ | 1.01 EUR |
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Produktbewertung abgeben
Technische Details HSB07-202009 Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 20 X 20 X 9 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.787" (20.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.787" (20.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 3.1W @ 75°C, Thermal Resistance @ Forced Air Flow: 8.60°C/W @ 200 LFM, Thermal Resistance @ Natural: 24.08°C/W, Fin Height: 0.354" (9.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB07-202009 nach Preis ab 1.07 EUR bis 1.41 EUR
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HSB07-202009 | Hersteller : CUI Devices |
Heat Sinks heat sink, BGA, 20 x 20 x 9 mm |
auf Bestellung 1853 Stücke: Lieferzeit 10-14 Tag (e) |
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| HSB07-202009 | Hersteller : Same Sky |
HSB07-202009 Heatsinks |
Produkt ist nicht verfügbar |
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HSB07-202009 | Hersteller : Same Sky |
Heat Sinks heat sink, BGA, 20 x 20 x 9 mm |
Produkt ist nicht verfügbar |