| Anzahl | Privatkunde |
|---|---|
| 2+ | 1.65 EUR |
| 10+ | 1.46 EUR |
| 25+ | 1.4 EUR |
| 50+ | 1.34 EUR |
| 100+ | 1.26 EUR |
| 204+ | 1.2 EUR |
| 408+ | 1.17 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Mindestmenge:
2 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details HSB07-202009 Same Sky
Description: HEAT SINK, BGA, 20 X 20 X 9 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.787" (20.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.787" (20.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 3.1W @ 75°C, Thermal Resistance @ Forced Air Flow: 8.60°C/W @ 200 LFM, Thermal Resistance @ Natural: 24.08°C/W, Fin Height: 0.354" (9.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB07-202009 nach Preis ab 1.26 EUR bis 1.82 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
HSB07-202009 | Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 20 X 20 X 9 MMPackaging: Box Material: Aluminum Alloy Length: 0.787" (20.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.787" (20.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 3.1W @ 75°C Thermal Resistance @ Forced Air Flow: 8.60°C/W @ 200 LFM Thermal Resistance @ Natural: 24.08°C/W Fin Height: 0.354" (9.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 5020 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB07-202009 |
|
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 20 X 20 X 9 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.787" (20.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.787" (20.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 3.1W @ 75°C
Thermal Resistance @ Forced Air Flow: 8.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 24.08°C/W
Fin Height: 0.354" (9.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, BGA, 20 X 20 X 9 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.787" (20.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.787" (20.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 3.1W @ 75°C
Thermal Resistance @ Forced Air Flow: 8.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 24.08°C/W
Fin Height: 0.354" (9.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 5020 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 12+ | 1.82 EUR |
| 13+ | 1.62 EUR |
| 25+ | 1.54 EUR |
| 50+ | 1.49 EUR |
| 204+ | 1.38 EUR |
| 408+ | 1.33 EUR |
| 612+ | 1.3 EUR |
| 1020+ | 1.26 EUR |