| Anzahl | Privatkunde |
|---|---|
| 2+ | 1.58 EUR |
| 10+ | 1.42 EUR |
| 25+ | 1.37 EUR |
| 50+ | 1.33 EUR |
| 88+ | 1.23 EUR |
| 264+ | 1.17 EUR |
| 528+ | 1.14 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Mindestmenge:
2 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details HSB09-212115 Same Sky
Description: HEAT SINK, BGA, 21 X 21 X 15 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.827" (21.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.827" (21.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 4.3W @ 75°C, Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM, Thermal Resistance @ Natural: 17.39°C/W, Fin Height: 0.591" (15.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB09-212115 nach Preis ab 1.25 EUR bis 1.82 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
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HSB09-212115 | CUI Devices |
 Heat Sinks heat sink, BGA, 21 x 21 x 15 mm |
auf Bestellung 3438 Stücke: Lieferzeit 10-14 Tag (e) |
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HSB09-212115 | Same Sky (Formerly CUI Devices) |
Description: HEAT SINK, BGA, 21 X 21 X 15 MM Packaging: Box Material: Aluminum Alloy Length: 0.827" (21.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.827" (21.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 4.3W @ 75°C Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM Thermal Resistance @ Natural: 17.39°C/W Fin Height: 0.591" (15.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1969 Stücke: Lieferzeit 10-14 Tag (e) |
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HSB09-212115 | Same Sky |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA; black; L: 21mm; W: 21mm; H: 15mm Mounting: for back plate Type of heatsink: extruded Heatsink shape: grilled Base thickness: 1.5mm Height: 15mm Length: 21mm Width: 21mm Thermal resistance @200 LFM: 6°C/W Thermal resistance: max. 23°C/W Material: aluminium Material finishing: anodized Application: BGA Colour: black |
auf Bestellung 490 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| HSB09-212115 |
|
Hersteller: CUI Devices
Heat Sinks heat sink, BGA, 21 x 21 x 15 mm
Heat Sinks heat sink, BGA, 21 x 21 x 15 mm
auf Bestellung 3438 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 1.64 EUR |
| 10+ | 1.56 EUR |
| 25+ | 1.49 EUR |
| 50+ | 1.44 EUR |
| 100+ | 1.43 EUR |
| 250+ | 1.33 EUR |
| 500+ | 1.25 EUR |
| HSB09-212115 |
|
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 21 X 21 X 15 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.827" (21.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.827" (21.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 4.3W @ 75°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 17.39°C/W
Fin Height: 0.591" (15.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, BGA, 21 X 21 X 15 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.827" (21.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.827" (21.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 4.3W @ 75°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 17.39°C/W
Fin Height: 0.591" (15.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1969 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 12+ | 1.82 EUR |
| 14+ | 1.61 EUR |
| 25+ | 1.54 EUR |
| 88+ | 1.44 EUR |
| 176+ | 1.38 EUR |
| 264+ | 1.36 EUR |
| 528+ | 1.31 EUR |
| 1056+ | 1.26 EUR |
| HSB09-212115 |
|
Hersteller: Same Sky
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 21mm; W: 21mm; H: 15mm
Mounting: for back plate
Type of heatsink: extruded
Heatsink shape: grilled
Base thickness: 1.5mm
Height: 15mm
Length: 21mm
Width: 21mm
Thermal resistance @200 LFM: 6°C/W
Thermal resistance: max. 23°C/W
Material: aluminium
Material finishing: anodized
Application: BGA
Colour: black
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 21mm; W: 21mm; H: 15mm
Mounting: for back plate
Type of heatsink: extruded
Heatsink shape: grilled
Base thickness: 1.5mm
Height: 15mm
Length: 21mm
Width: 21mm
Thermal resistance @200 LFM: 6°C/W
Thermal resistance: max. 23°C/W
Material: aluminium
Material finishing: anodized
Application: BGA
Colour: black
auf Bestellung 490 Stücke:
Lieferzeit 14-21 Tag (e)