auf Bestellung 3438 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 1.56 EUR |
| 10+ | 1.47 EUR |
| 25+ | 1.4 EUR |
| 50+ | 1.36 EUR |
| 100+ | 1.34 EUR |
| 250+ | 1.25 EUR |
| 500+ | 1.18 EUR |
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Technische Details HSB09-212115 CUI Devices
Description: HEAT SINK, BGA, 21 X 21 X 15 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.827" (21.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.827" (21.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 4.3W @ 75°C, Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM, Thermal Resistance @ Natural: 17.39°C/W, Fin Height: 0.591" (15.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB09-212115 nach Preis ab 0.79 EUR bis 1.6 EUR
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HSB09-212115 | Hersteller : Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 21 X 21 X 15 MMPackaging: Box Material: Aluminum Alloy Length: 0.827" (21.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.827" (21.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 4.3W @ 75°C Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM Thermal Resistance @ Natural: 17.39°C/W Fin Height: 0.591" (15.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1014 Stücke: Lieferzeit 10-14 Tag (e) |
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| HSB09-212115 | Hersteller : Same Sky |
Category: Heatsinks Description: Heatsink: extruded; grilled; black; L: 21mm; W: 21mm; H: 15mm Length: 21mm Height: 15mm Width: 21mm Material: aluminium Thermal resistance: max. 23°C/W Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized Base thickness: 1.5mm Thermal resistance @200 LFM: 6°C/W Colour: black Mounting: for back plate Anzahl je Verpackung: 1152 Stücke |
auf Bestellung 1152 Stücke: Lieferzeit 7-14 Tag (e) |
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| HSB09-212115 | Hersteller : Same Sky |
Category: Heatsinks Description: Heatsink: extruded; grilled; black; L: 21mm; W: 21mm; H: 15mm Length: 21mm Height: 15mm Width: 21mm Material: aluminium Thermal resistance: max. 23°C/W Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized Base thickness: 1.5mm Thermal resistance @200 LFM: 6°C/W Colour: black Mounting: for back plate |
auf Bestellung 1152 Stücke: Lieferzeit 14-21 Tag (e) |
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| HSB09-212115 | Hersteller : CUI DEVICES |
21 x 21 mm, BGA Heat Sink, Aluminum, PCB |
Produkt ist nicht verfügbar |