HSB09-212115 Same Sky
Hersteller: Same Sky
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 21mm; W: 21mm; H: 15mm
Mounting: for back plate
Type of heatsink: extruded
Heatsink shape: grilled
Base thickness: 1.5mm
Height: 15mm
Length: 21mm
Width: 21mm
Thermal resistance @200 LFM: 6°C/W
Thermal resistance: max. 23°C/W
Material: aluminium
Material finishing: anodized
Application: BGA
Colour: black
| Anzahl | Preis |
|---|---|
| 65+ | 1.1 EUR |
| 72+ | 1 EUR |
| 96+ | 0.92 EUR |
| 288+ | 0.87 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HSB09-212115 Same Sky
Description: HEAT SINK, BGA, 21 X 21 X 15 MM, Part Status: Active, Material Finish: Black Anodized, Fin Height: 0.591" (15.00mm), Thermal Resistance @ Natural: 17.39°C/W, Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM, Power Dissipation @ Temperature Rise: 4.3W @ 75°C, Attachment Method: Adhesive (Not Included), Package Cooled: BGA, Width: 0.827" (21.00mm), Type: Top Mount, Shape: Square, Pin Fins, Length: 0.827" (21.00mm), Material: Aluminum Alloy, Packaging: Box.
Weitere Produktangebote HSB09-212115 nach Preis ab 0.98 EUR bis 1.56 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
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HSB09-212115 | Same Sky (Formerly CUI Devices) |
Description: HEAT SINK, BGA, 21 X 21 X 15 MM Part Status: Active Material Finish: Black Anodized Fin Height: 0.591" (15.00mm) Thermal Resistance @ Natural: 17.39°C/W Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM Power Dissipation @ Temperature Rise: 4.3W @ 75°C Attachment Method: Adhesive (Not Included) Package Cooled: BGA Width: 0.827" (21.00mm) Type: Top Mount Shape: Square, Pin Fins Length: 0.827" (21.00mm) Material: Aluminum Alloy Packaging: Box |
auf Bestellung 2835 Stücke: Lieferzeit 10-14 Tag (e) |
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HSB09-212115 | CUI Devices |
Heat Sinks heat sink, BGA, 21 x 21 x 15 mm |
auf Bestellung 3438 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB09-212115 |
|
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 21 X 21 X 15 MM
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.591" (15.00mm)
Thermal Resistance @ Natural: 17.39°C/W
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 4.3W @ 75°C
Attachment Method: Adhesive (Not Included)
Package Cooled: BGA
Width: 0.827" (21.00mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 0.827" (21.00mm)
Material: Aluminum Alloy
Packaging: Box
Description: HEAT SINK, BGA, 21 X 21 X 15 MM
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.591" (15.00mm)
Thermal Resistance @ Natural: 17.39°C/W
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 4.3W @ 75°C
Attachment Method: Adhesive (Not Included)
Package Cooled: BGA
Width: 0.827" (21.00mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 0.827" (21.00mm)
Material: Aluminum Alloy
Packaging: Box
auf Bestellung 2835 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 13+ | 1.43 EUR |
| 14+ | 1.26 EUR |
| 25+ | 1.2 EUR |
| 50+ | 1.16 EUR |
| 100+ | 1.12 EUR |
| 250+ | 1.06 EUR |
| 500+ | 1.02 EUR |
| 1152+ | 0.98 EUR |
| HSB09-212115 |
|
Hersteller: CUI Devices
Heat Sinks heat sink, BGA, 21 x 21 x 15 mm
Heat Sinks heat sink, BGA, 21 x 21 x 15 mm
auf Bestellung 3438 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 1.56 EUR |
| 10+ | 1.47 EUR |
| 25+ | 1.4 EUR |
| 50+ | 1.36 EUR |
| 100+ | 1.34 EUR |
| 250+ | 1.25 EUR |
| 500+ | 1.18 EUR |