HSB10-232306 CUI Devices
Hersteller: CUI Devices
Description: HEAT SINK, BGA, 23 X 23 X 6 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.906" (23.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.00mm)
Package Cooled: BGA
Attachment Method: Adhesive
Power Dissipation @ Temperature Rise: 3.0W @ 75°C
Thermal Resistance @ Forced Air Flow: 9.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 25.46°C/W
Fin Height: 0.236" (6.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, BGA, 23 X 23 X 6 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.906" (23.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.00mm)
Package Cooled: BGA
Attachment Method: Adhesive
Power Dissipation @ Temperature Rise: 3.0W @ 75°C
Thermal Resistance @ Forced Air Flow: 9.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 25.46°C/W
Fin Height: 0.236" (6.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1321 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
13+ | 2.05 EUR |
14+ | 1.94 EUR |
25+ | 1.84 EUR |
50+ | 1.79 EUR |
100+ | 1.77 EUR |
250+ | 1.65 EUR |
500+ | 1.55 EUR |
1000+ | 1.4 EUR |
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Technische Details HSB10-232306 CUI Devices
Description: HEAT SINK, BGA, 23 X 23 X 6 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.906" (23.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.906" (23.00mm), Package Cooled: BGA, Attachment Method: Adhesive, Power Dissipation @ Temperature Rise: 3.0W @ 75°C, Thermal Resistance @ Forced Air Flow: 9.60°C/W @ 200 LFM, Thermal Resistance @ Natural: 25.46°C/W, Fin Height: 0.236" (6.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB10-232306 nach Preis ab 1.89 EUR bis 2.13 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||
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HSB10-232306 | Hersteller : CUI Devices | Heat Sinks heat sink, BGA, 23 x 23 x 6 mm |
auf Bestellung 1420 Stücke: Lieferzeit 14-28 Tag (e) |
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