| Anzahl | Privatkunde |
|---|---|
| 3+ | 1.57 EUR |
| 10+ | 1.42 EUR |
| 25+ | 1.34 EUR |
| 176+ | 1.24 EUR |
| 528+ | 1.21 EUR |
| 1056+ | 1.09 EUR |
Produktrezensionen
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Technische Details HSB10-232306 Same Sky
Description: HEAT SINK, BGA, 23 X 23 X 6 MM, Part Status: Active, Material Finish: Black Anodized, Fin Height: 0.236" (6.00mm), Thermal Resistance @ Natural: 25.46°C/W, Thermal Resistance @ Forced Air Flow: 9.60°C/W @ 200 LFM, Power Dissipation @ Temperature Rise: 3.0W @ 75°C, Attachment Method: Adhesive, Package Cooled: BGA, Width: 0.906" (23.00mm), Type: Top Mount, Shape: Square, Pin Fins, Length: 0.906" (23.00mm), Material: Aluminum Alloy, Packaging: Box.
Weitere Produktangebote HSB10-232306 nach Preis ab 1.13 EUR bis 1.65 EUR
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HSB10-232306 | CUI Devices |
 Heat Sinks heat sink, BGA, 23 x 23 x 6 mm |
auf Bestellung 1765 Stücke: Lieferzeit 10-14 Tag (e) |
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HSB10-232306 | CUI Devices |
Description: HEAT SINK, BGA, 23 X 23 X 6 MM Part Status: Active Material Finish: Black Anodized Fin Height: 0.236" (6.00mm) Thermal Resistance @ Natural: 25.46°C/W Thermal Resistance @ Forced Air Flow: 9.60°C/W @ 200 LFM Power Dissipation @ Temperature Rise: 3.0W @ 75°C Attachment Method: Adhesive Package Cooled: BGA Width: 0.906" (23.00mm) Type: Top Mount Shape: Square, Pin Fins Length: 0.906" (23.00mm) Material: Aluminum Alloy Packaging: Box |
auf Bestellung 1321 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB10-232306 |
|
Hersteller: CUI Devices
Heat Sinks heat sink, BGA, 23 x 23 x 6 mm
Heat Sinks heat sink, BGA, 23 x 23 x 6 mm
auf Bestellung 1765 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 1.63 EUR |
| 10+ | 1.55 EUR |
| 25+ | 1.4 EUR |
| 50+ | 1.39 EUR |
| 100+ | 1.31 EUR |
| 250+ | 1.24 EUR |
| 500+ | 1.18 EUR |
| HSB10-232306 |
|
Hersteller: CUI Devices
Description: HEAT SINK, BGA, 23 X 23 X 6 MM
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.236" (6.00mm)
Thermal Resistance @ Natural: 25.46°C/W
Thermal Resistance @ Forced Air Flow: 9.60°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 75°C
Attachment Method: Adhesive
Package Cooled: BGA
Width: 0.906" (23.00mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 0.906" (23.00mm)
Material: Aluminum Alloy
Packaging: Box
Description: HEAT SINK, BGA, 23 X 23 X 6 MM
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.236" (6.00mm)
Thermal Resistance @ Natural: 25.46°C/W
Thermal Resistance @ Forced Air Flow: 9.60°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 75°C
Attachment Method: Adhesive
Package Cooled: BGA
Width: 0.906" (23.00mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 0.906" (23.00mm)
Material: Aluminum Alloy
Packaging: Box
auf Bestellung 1321 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 13+ | 1.65 EUR |
| 14+ | 1.56 EUR |
| 25+ | 1.48 EUR |
| 50+ | 1.44 EUR |
| 100+ | 1.43 EUR |
| 250+ | 1.32 EUR |
| 500+ | 1.25 EUR |
| 1000+ | 1.13 EUR |