HSB30-373710 CUI Devices
auf Bestellung 319 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 3.66 EUR |
| 10+ | 3.54 EUR |
| 25+ | 3.43 EUR |
| 50+ | 3.22 EUR |
| 100+ | 2.9 EUR |
| 250+ | 2.87 EUR |
| 500+ | 2.69 EUR |
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Technische Details HSB30-373710 CUI Devices
Description: HEAT SINK, BGA, 37.4 X 37 X 10 M, Packaging: Box, Material: Aluminum Alloy, Length: 1.472" (37.39mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.472" (37.39mm), Package Cooled: BGA, Attachment Method: Push Pin, Power Dissipation @ Temperature Rise: 6.45W @ 75°C, Thermal Resistance @ Forced Air Flow: 4°C/W @ 200 LFM, Thermal Resistance @ Natural: 11.63°C/W, Fin Height: 0.394" (10.00mm), Material Finish: Black Anodized.
Weitere Produktangebote HSB30-373710 nach Preis ab 2.91 EUR bis 3.84 EUR
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HSB30-373710 | Hersteller : Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 37.4 X 37 X 10 MPackaging: Box Material: Aluminum Alloy Length: 1.472" (37.39mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.472" (37.39mm) Package Cooled: BGA Attachment Method: Push Pin Power Dissipation @ Temperature Rise: 6.45W @ 75°C Thermal Resistance @ Forced Air Flow: 4°C/W @ 200 LFM Thermal Resistance @ Natural: 11.63°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized |
auf Bestellung 314 Stücke: Lieferzeit 10-14 Tag (e) |
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