HSB31-212105 Same Sky (Formerly CUI Devices)
Hersteller: Same Sky (Formerly CUI Devices)Description: HEAT SINK, BGA, 21 X 21 X 5 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.827" (21.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.827" (21.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 3.0W @ 75°C
Thermal Resistance @ Forced Air Flow: 9.90°C/W @ 200 LFM
Thermal Resistance @ Natural: 25.33°C/W
Fin Height: 0.197" (5.00mm)
Material Finish: Black Anodized
auf Bestellung 1692 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 14+ | 1.32 EUR |
| 16+ | 1.16 EUR |
| 25+ | 1.11 EUR |
| 50+ | 1.07 EUR |
| 100+ | 1.03 EUR |
| 250+ | 0.98 EUR |
| 500+ | 0.94 EUR |
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Technische Details HSB31-212105 Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 21 X 21 X 5 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.827" (21.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.827" (21.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 3.0W @ 75°C, Thermal Resistance @ Forced Air Flow: 9.90°C/W @ 200 LFM, Thermal Resistance @ Natural: 25.33°C/W, Fin Height: 0.197" (5.00mm), Material Finish: Black Anodized.
Weitere Produktangebote HSB31-212105 nach Preis ab 1.05 EUR bis 1.39 EUR
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HSB31-212105 | Hersteller : CUI Devices |
Heat Sinks heat sink, BGA, 21 x 21 x 5 mm |
auf Bestellung 1853 Stücke: Lieferzeit 10-14 Tag (e) |
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HSB31-212105 | Hersteller : Same Sky |
Heat Sinks heat sink, BGA, 21 x 21 x 5 mm |
auf Bestellung 1702 Stücke: Lieferzeit 10-14 Tag (e) |
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