| Anzahl | Preis |
|---|---|
| 3+ | 1.32 EUR |
| 10+ | 1.16 EUR |
| 25+ | 1.13 EUR |
| 50+ | 1.1 EUR |
| 120+ | 1.04 EUR |
| 240+ | 0.98 EUR |
| 600+ | 0.95 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HSB31-212105 Same Sky
Description: HEAT SINK, BGA, 21 X 21 X 5 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.827" (21.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.827" (21.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 3.0W @ 75°C, Thermal Resistance @ Forced Air Flow: 9.90°C/W @ 200 LFM, Thermal Resistance @ Natural: 25.33°C/W, Fin Height: 0.197" (5.00mm), Material Finish: Black Anodized.
Weitere Produktangebote HSB31-212105 nach Preis ab 0.94 EUR bis 1.32 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
HSB31-212105 | Hersteller : Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 21 X 21 X 5 MMPackaging: Box Material: Aluminum Alloy Length: 0.827" (21.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.827" (21.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 3.0W @ 75°C Thermal Resistance @ Forced Air Flow: 9.90°C/W @ 200 LFM Thermal Resistance @ Natural: 25.33°C/W Fin Height: 0.197" (5.00mm) Material Finish: Black Anodized |
auf Bestellung 1692 Stücke: Lieferzeit 10-14 Tag (e) |
|