| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.59 EUR |
| 10+ | 2.32 EUR |
| 25+ | 2.23 EUR |
| 50+ | 2.12 EUR |
| 100+ | 2.03 EUR |
| 250+ | 1.95 EUR |
| 500+ | 1.93 EUR |
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Technische Details HSB33-272710 Same Sky
Description: HEAT SINK, BGA, 27 X 27 X 10 MM,, Packaging: Box, Material: Aluminum Alloy, Length: 1.063" (27.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.063" (27.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 4.4W @ 75°C, Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM, Thermal Resistance @ Natural: 17.22°C/W, Fin Height: 0.394" (10.00mm), Material Finish: Black Anodized.
Weitere Produktangebote HSB33-272710 nach Preis ab 1.94 EUR bis 2.59 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
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HSB33-272710 | Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 27 X 27 X 10 MM,Packaging: Box Material: Aluminum Alloy Length: 1.063" (27.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.063" (27.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 4.4W @ 75°C Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM Thermal Resistance @ Natural: 17.22°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized |
auf Bestellung 323 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB33-272710 |
|
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 27 X 27 X 10 MM,
Packaging: Box
Material: Aluminum Alloy
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 4.4W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 17.22°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Description: HEAT SINK, BGA, 27 X 27 X 10 MM,
Packaging: Box
Material: Aluminum Alloy
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 4.4W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 17.22°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
auf Bestellung 323 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 9+ | 2.59 EUR |
| 10+ | 2.3 EUR |
| 25+ | 2.19 EUR |
| 50+ | 2.11 EUR |
| 100+ | 2.03 EUR |
| 250+ | 1.94 EUR |