| Anzahl | Privatkunde |
|---|---|
| 1+ | 3.52 EUR |
| 10+ | 3.14 EUR |
| 25+ | 3 EUR |
| 50+ | 2.89 EUR |
| 70+ | 2.7 EUR |
| 280+ | 2.57 EUR |
| 560+ | 2.45 EUR |
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Produktbewertung abgeben
Technische Details HSB35-272725 Same Sky
Description: HEAT SINK, BGA, 27 X 27 X 25 MM,, Packaging: Box, Material: Aluminum Alloy, Length: 1.063" (27.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.063" (27.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 8.6W @ 75°C, Thermal Resistance @ Forced Air Flow: 2.90°C/W @ 200 LFM, Thermal Resistance @ Natural: 8.74°C/W, Fin Height: 0.984" (25.00mm), Material Finish: Black Anodized.
Weitere Produktangebote HSB35-272725 nach Preis ab 2.68 EUR bis 3.72 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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HSB35-272725 | CUI Devices |
 Heat Sinks heat sink, BGA, 27 x 27 x 25 mm, channel |
auf Bestellung 513 Stücke: Lieferzeit 10-14 Tag (e) |
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HSB35-272725 | Same Sky (Formerly CUI Devices) |
Description: HEAT SINK, BGA, 27 X 27 X 25 MM, Packaging: Box Material: Aluminum Alloy Length: 1.063" (27.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.063" (27.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 8.6W @ 75°C Thermal Resistance @ Forced Air Flow: 2.90°C/W @ 200 LFM Thermal Resistance @ Natural: 8.74°C/W Fin Height: 0.984" (25.00mm) Material Finish: Black Anodized |
auf Bestellung 257 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB35-272725 |
|
Hersteller: CUI Devices
Heat Sinks heat sink, BGA, 27 x 27 x 25 mm, channel
Heat Sinks heat sink, BGA, 27 x 27 x 25 mm, channel
auf Bestellung 513 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 3.58 EUR |
| 10+ | 3.42 EUR |
| 25+ | 3.33 EUR |
| 50+ | 3.22 EUR |
| 100+ | 3.06 EUR |
| 250+ | 2.87 EUR |
| 500+ | 2.68 EUR |
| HSB35-272725 |
|
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 27 X 27 X 25 MM,
Packaging: Box
Material: Aluminum Alloy
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 8.6W @ 75°C
Thermal Resistance @ Forced Air Flow: 2.90°C/W @ 200 LFM
Thermal Resistance @ Natural: 8.74°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Description: HEAT SINK, BGA, 27 X 27 X 25 MM,
Packaging: Box
Material: Aluminum Alloy
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 8.6W @ 75°C
Thermal Resistance @ Forced Air Flow: 2.90°C/W @ 200 LFM
Thermal Resistance @ Natural: 8.74°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
auf Bestellung 257 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 3.72 EUR |
| 10+ | 3.32 EUR |
| 25+ | 3.17 EUR |
| 50+ | 3.05 EUR |
| 100+ | 2.94 EUR |
| 250+ | 2.81 EUR |