HSB35-272725 CUI Devices
auf Bestellung 513 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 3.01 EUR |
| 10+ | 2.87 EUR |
| 25+ | 2.8 EUR |
| 50+ | 2.71 EUR |
| 100+ | 2.57 EUR |
| 250+ | 2.41 EUR |
| 500+ | 2.25 EUR |
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Technische Details HSB35-272725 CUI Devices
Description: HEAT SINK, BGA, 27 X 27 X 25 MM,, Packaging: Box, Material: Aluminum Alloy, Length: 1.063" (27.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.063" (27.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 8.6W @ 75°C, Thermal Resistance @ Forced Air Flow: 2.90°C/W @ 200 LFM, Thermal Resistance @ Natural: 8.74°C/W, Fin Height: 0.984" (25.00mm), Material Finish: Black Anodized.
Weitere Produktangebote HSB35-272725 nach Preis ab 2.36 EUR bis 3.13 EUR
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HSB35-272725 | Hersteller : Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 27 X 27 X 25 MM,Packaging: Box Material: Aluminum Alloy Length: 1.063" (27.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.063" (27.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 8.6W @ 75°C Thermal Resistance @ Forced Air Flow: 2.90°C/W @ 200 LFM Thermal Resistance @ Natural: 8.74°C/W Fin Height: 0.984" (25.00mm) Material Finish: Black Anodized |
auf Bestellung 257 Stücke: Lieferzeit 10-14 Tag (e) |
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| HSB35-272725 | Hersteller : Same Sky |
HSB35-272725 Heatsinks |
Produkt ist nicht verfügbar |