HSB40-252510P Same Sky
| Anzahl | Privatkunde |
|---|---|
| 1+ | 4.5 EUR |
| 10+ | 4 EUR |
| 25+ | 3.8 EUR |
| 50+ | 3.71 EUR |
| 70+ | 3.45 EUR |
| 280+ | 3.33 EUR |
| 560+ | 3.2 EUR |
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Technische Details HSB40-252510P Same Sky
Description: HEAT SINK, BGA, 25 X 25 X 10 MM,, Packaging: Box, Material: Aluminum Alloy, Length: 0.984" (25.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.984" (25.00mm), Package Cooled: BGA, Attachment Method: Push Pin, Power Dissipation @ Temperature Rise: 4.2W @ 75°C, Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM, Thermal Resistance @ Natural: 17.87°C/W, Fin Height: 0.394" (10.00mm), Material Finish: Black Anodized.
Weitere Produktangebote HSB40-252510P nach Preis ab 3.75 EUR bis 4.99 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
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HSB40-252510P | Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 25 X 25 X 10 MM,Packaging: Box Material: Aluminum Alloy Length: 0.984" (25.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.984" (25.00mm) Package Cooled: BGA Attachment Method: Push Pin Power Dissipation @ Temperature Rise: 4.2W @ 75°C Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM Thermal Resistance @ Natural: 17.87°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized |
auf Bestellung 371 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSB40-252510P |
|
Hersteller: Same Sky (Formerly CUI Devices)
Description: HEAT SINK, BGA, 25 X 25 X 10 MM,
Packaging: Box
Material: Aluminum Alloy
Length: 0.984" (25.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.984" (25.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Power Dissipation @ Temperature Rise: 4.2W @ 75°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 17.87°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Description: HEAT SINK, BGA, 25 X 25 X 10 MM,
Packaging: Box
Material: Aluminum Alloy
Length: 0.984" (25.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.984" (25.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Power Dissipation @ Temperature Rise: 4.2W @ 75°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 17.87°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
auf Bestellung 371 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 4.99 EUR |
| 10+ | 4.43 EUR |
| 25+ | 4.22 EUR |
| 50+ | 4.08 EUR |
| 100+ | 3.94 EUR |
| 250+ | 3.75 EUR |