| Anzahl | Preis |
|---|---|
| 1+ | 10.58 EUR |
| 10+ | 9.36 EUR |
| 25+ | 8.76 EUR |
| 35+ | 8.27 EUR |
| 105+ | 8.24 EUR |
| 280+ | 7.57 EUR |
| 525+ | 7.3 EUR |
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Technische Details HSB44-606010P Same Sky
Description: HEAT SINK, BGA, 60 X 60 X 10 MM,, Packaging: Box, Material: Aluminum Alloy, Length: 2.362" (60.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 2.362" (60.00mm), Package Cooled: BGA, Attachment Method: Push Pin, Power Dissipation @ Temperature Rise: 7.4W @ 75°C, Thermal Resistance @ Forced Air Flow: 2.70°C/W @ 200 LFM, Thermal Resistance @ Natural: 10.09°C/W, Fin Height: 0.394" (10.00mm), Material Finish: Clean Finished.
Weitere Produktangebote HSB44-606010P
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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HSB44-606010P | Hersteller : Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 60 X 60 X 10 MM,Packaging: Box Material: Aluminum Alloy Length: 2.362" (60.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 2.362" (60.00mm) Package Cooled: BGA Attachment Method: Push Pin Power Dissipation @ Temperature Rise: 7.4W @ 75°C Thermal Resistance @ Forced Air Flow: 2.70°C/W @ 200 LFM Thermal Resistance @ Natural: 10.09°C/W Fin Height: 0.394" (10.00mm) Material Finish: Clean Finished |
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