Technische Details HSB45-383818 Same Sky
Description: HEAT SINK, BGA, 38.1 X 38.1 X 18, Packaging: Box, Material: Copper, Length: 1.496" (38.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.496" (38.00mm), Package Cooled: BGA, Attachment Method: Adhesive (Not Included), Power Dissipation @ Temperature Rise: 7.5W @ 75°C, Thermal Resistance @ Forced Air Flow: 2.90°C/W @ 200 LFM, Thermal Resistance @ Natural: 10.05°C/W, Fin Height: 0.709" (18.00mm), Material Finish: Clean Finished.
Weitere Produktangebote HSB45-383818
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HSB45-383818 | Hersteller : Same Sky (Formerly CUI Devices) |
 Description: HEAT SINK, BGA, 38.1 X 38.1 X 18Packaging: Box Material: Copper Length: 1.496" (38.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.496" (38.00mm) Package Cooled: BGA Attachment Method: Adhesive (Not Included) Power Dissipation @ Temperature Rise: 7.5W @ 75°C Thermal Resistance @ Forced Air Flow: 2.90°C/W @ 200 LFM Thermal Resistance @ Natural: 10.05°C/W Fin Height: 0.709" (18.00mm) Material Finish: Clean Finished |
Produkt ist nicht verfügbar |
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HSB45-383818 | Hersteller : CUI Devices |
Heat Sinks heat sink, BGA, 38.1 x 38.1 x 18 mm, pin fin |
Produkt ist nicht verfügbar |
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HSB45-383818 | Hersteller : Same Sky |
Heat Sinks heat sink, BGA, 38.1 x 38.1 x 18 mm, pin fin |
Produkt ist nicht verfügbar |