HSE-B18254-0396H CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, EXTRUSION,TO-218, 25.
Packaging: Box
Material: Aluminum Alloy
Length: 1.000" (25.40mm)
Shape: Rectangular, Angled Fins
Type: Board Level, Vertical
Width: 1.654" (42.00mm)
Package Cooled: TO-218
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 8.2W @ 75°C
Thermal Resistance @ Forced Air Flow: 2.29°C/W @ 200 LFM
Thermal Resistance @ Natural: 9.15°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1786 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 7+ | 2.9 EUR |
| 10+ | 2.76 EUR |
| 25+ | 2.69 EUR |
| 50+ | 2.62 EUR |
| 100+ | 2.47 EUR |
| 250+ | 2.33 EUR |
| 500+ | 2.18 EUR |
| 1000+ | 2.04 EUR |
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Technische Details HSE-B18254-0396H CUI Devices
Description: HEAT SINK, EXTRUSION,TO-218, 25., Packaging: Box, Material: Aluminum Alloy, Length: 1.000" (25.40mm), Shape: Rectangular, Angled Fins, Type: Board Level, Vertical, Width: 1.654" (42.00mm), Package Cooled: TO-218, Attachment Method: Bolt On and PC Pin, Power Dissipation @ Temperature Rise: 8.2W @ 75°C, Thermal Resistance @ Forced Air Flow: 2.29°C/W @ 200 LFM, Thermal Resistance @ Natural: 9.15°C/W, Fin Height: 0.984" (25.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSE-B18254-0396H nach Preis ab 3.25 EUR bis 4.34 EUR
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HSE-B18254-0396H | Hersteller : CUI Devices |
Heat Sinks 25.4x42x25mm w/pin extrusion TO-218 |
auf Bestellung 86 Stücke: Lieferzeit 14-28 Tag (e) |
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