HSE-B18317-035H-01 CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, EXTRUSION, TO-218, 31
Packaging: Box
Material: Aluminum Alloy
Length: 1.250" (31.75mm)
Shape: Rectangular, Angled Fins
Type: Board Level, Vertical
Width: 1.638" (41.60mm)
Package Cooled: TO-218
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 10.0W @ 75°C
Thermal Resistance @ Forced Air Flow: 4.33°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.50°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
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Technische Details HSE-B18317-035H-01 CUI Devices
Description: HEAT SINK, EXTRUSION, TO-218, 31, Packaging: Box, Material: Aluminum Alloy, Length: 1.250" (31.75mm), Shape: Rectangular, Angled Fins, Type: Board Level, Vertical, Width: 1.638" (41.60mm), Package Cooled: TO-218, Attachment Method: Clip and PC Pin, Power Dissipation @ Temperature Rise: 10.0W @ 75°C, Thermal Resistance @ Forced Air Flow: 4.33°C/W @ 200 LFM, Thermal Resistance @ Natural: 7.50°C/W, Fin Height: 0.984" (25.00mm), Material Finish: Black Anodized.
Weitere Produktangebote HSE-B18317-035H-01
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Verfügbarkeit |
Preis |
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HSE-B18317-035H-01 | Hersteller : CUI Devices |
Heat Sinks 31.75x41.6x25mm pin extrusion TO-218 |
Produkt ist nicht verfügbar |
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HSE-B18317-035H-01 | Hersteller : Same Sky |
Heat Sinks 31.75x41.6x25mm pin extrusion TO-218 |
Produkt ist nicht verfügbar |